STM32F103ZD datasheet(11/130 Pages) STMICROELECTRONICS

Part #	STM32F103ZD

Description	High-density performance line ARM-based 32-bit MCU

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STM32F103xC, STM32F103xD, STM32F103xE

Description

Doc ID 14611 Rev 8

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2.1

Device overview

The STM32F103xx high-density performance line family offers devices in six different

package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of

peripherals are included, the description below gives an overview of the complete range of

peripherals proposed in this family.

Figure 1 shows the general block diagram of the device family.

Table 2.

STM32F103xC, STM32F103xD and STM32F103xE features and peripheral

counts

Peripherals

STM32F103Rx

STM32F103Vx

STM32F103Zx

Flash memory in Kbytes

256

384

512

256

384

512

256

384

512

SRAM in Kbytes

48

64(1)

1.

64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.

48

64

48

64

FSMC

No

Yes(2)

2.

For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only

support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or

8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is

not available in this package.

Yes

Timers

General-purpose

4

Advanced-control

2

Basic

2

Comm

SPI(I2S)(3)

3.

The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the

I2S audio mode.

3(2)

I2C2

USART

5

USB

1

CAN

1

SDIO

1

GPIOs

51

80

112

12-bit ADC

Number of channels

3

16

3

16

3

21

12-bit DAC

Number of channels

2

CPU frequency

72 MHz

Operating voltage

2.0 to 3.6 V

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)

Junction temperature: –40 to + 125 °C (see Table 10)

Package

LQFP64, WLCSP64

LQFP100, BGA100

LQFP144, BGA144

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