SDE1006A Series - SMD Power Inductors

Soldering Profile

DIMENSIONS:

MM

(INCHES)

Packaging Specifications

EMBOSSED

CARRIER

EMBOSSED

CAVITY

0.10

(.004)

THICKNESS

MAX.

24.0

(.945)

26 +0

(1.02 +.000)

30.4

(1.20)

2.0 ± 0.5

(.079 ± .020)

50.0 -0

(1.969 - .000)

330

(12.99)

DIA.

13.0 ± 0.5

(.512 ± .020)

DIA.

13.0 ± 0.5

(.512 ± .020)

DIA.

21.0 ± 0.8

(.827 ± .031)

QTY: 800 PCS. PER REEL

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

REV. 09/13

Asia-Pacific:

Tel: +886-2 2562-4117

Fax: +886-2 2562-4116

Europe:

Tel: +41-41 768 5555

Fax: +41-41 768 5510

The Americas:

Tel: +1-951 781-5500

Fax: +1-951 781-5700

www.bourns.com

200

Max. Peak Temperature -5

30 sec. max.

Max. Time Above 217

: 60~150 sec. max.

Peak Temperature 245

max.

250

150

200

100

50

0

100

50

150

Time (Seconds)

+4.0 °C/Sec. Max.

150~200 °C / 60~120 Sec.

+3.0 °C/Sec. Max.

-(1.0~5.0) °C/Sec. Max.

Temperature

Rising Area

Preheat

Area

Reflow

Area

Forced

Cooling Area

250

Peak Temperature: 245 °C

217 °C

60~120 Sec.

60 Sec.

Max.

60~150 Sec.

4

(.157)

12

(.472)

END

START

USER DIRECTION OF FEED

350

(13.780)

NO COMPONENT

NO COMPONENT

COMPONENTS

400

(15.748)

100

100

100

100

100

100