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CW100505-3N3J Datasheet(PDF) 1 Page - Bourns Electronic Solutions

Part # CW100505-3N3J
Description  CW100505 Series High Q Ceramic Chip Inductors
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Manufacturer  BOURNS [Bourns Electronic Solutions]
Direct Link  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

CW100505-3N3J Datasheet(HTML) 1 Page - Bourns Electronic Solutions

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0.20
(.008)
0.50 ± 0.1
(.020 ± .004)
0.55 ± 0.1
(.022 ± .004)
0.40
(.016)
0.30
(.012)
1.00 ± 0.1
(.039 ± .004)
0.20
(.008)
0.50
(.020)
0.40
(.016)
0.50
(.020)
0.50
(.020)
Features
0402 miniature size
Ceramic core provides stable electrical
characteristics
High Q
High self-resonant frequency
Flat top surface for automated assembly
RoHS compliant* and halogen free**
Applications
RF modules
Cellular phones
GPS receivers
Wireless PDAs, LANs
CATV filters, tuners
Cable modems, set-top boxes
CW100505 Series High Q Ceramic Chip Inductors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Operating Temperature
................................-55 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-55 °C to +125 °C
Resistance to Soldering Heat
.......................... +260 °C, 5 sec. max.
Temperature Rise .....15 °C at rated Irms
Electrical Specifications
Bourns® Part No.
Inductance
Q
Test Freq.
(MHz)
SRF
(MHz)
DCR
(Ohms)
Irms
(mA)
L (nH)
Tol.
Min.
L / Q
Min.
Max.
CW100505-1N0D
1.0
±0.3 nH
13
250
6000
0.045
1360
CW100505-2N2D
2.2
±0.3 nH
18
250
6000
0.070
960
CW100505-2N7D
2.7
±0.3 nH
16
250
6000
0.120
640
CW100505-3N3J
3.3
±5 %
20
250
6000
0.066
840
CW100505-3N9J
3.9
±5 %
20
250
5800
0.066
840
CW100505-4N7J
4.7
±5 %
15
250
4775
0.130
640
CW100505-5N6J
5.6
±5 %
23
250
5800
0.083
760
CW100505-6N8J
6.8
±5 %
20
250
4800
0.083
680
CW100505-8N2J
8.2
±5 %
25
250
4400
0.104
680
CW100505-10NJ
10.0
±5 %
23
250
3900
0.195
480
CW100505-12NJ
12.0
±5 %
26
250
3600
0.120
640
CW100505-15NJ
15.0
±5 %
26
250
3280
0.172
560
CW100505-18NJ
18.0
±5 %
25
250
3100
0.230
420
CW100505-22NJ
22.0
±5 %
25
250
2800
0.300
400
CW100505-27NJ
27.0
±5 %
26
250
2480
0.298
400
CW100505-33NJ
33.0
±5 %
24
250
2350
0.350
400
CW100505-39NJ
39.0
±5 %
25
250
2100
0.550
320
CW100505-47NJ
47.0
±5 %
26
200
2100
0.830
210
CW100505-56NJ
56.0
±5 %
22
200
1760
0.970
200
CW100505-68NJ
68.0
±5 %
22
200
1620
1.120
180
CW100505-82NJ
82.0
±5 %
20
150
1500
1.250
150
CW100505-R10J
100.0
±5 %
20
150
1300
2.520
120
CW100505-R12J
120.0
±5 %
20
150
1100
2.660
110
General Specifications
Core...........................................Ceramic
Wire ............Enameled copper (Class H)
Terminal ........................... Mo/Mn+Ni+Au
Packaging.... 10,000 pcs. per 7-inch reel
Materials
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Recommended Layout
Schematic
Soldering Profile
0
Time (Seconds)
50
100
150
200
250
50
100
150
200
250
70 SECONDS MAX.
Temperature
Rising
Area
4 °C/
Sec.
Max.
-
50 SECONDS MAX.
PEAK TEMP.
260 °C
230 °C
-
-
Preheat
Area
150~200 °C / 60~120 Sec.
-
Reflow
Area
20~
40 °C/
Sec.
Max.
-
Forced Cooling
Area
-1~5 °C/Sec. Max.


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