L9D3256M72SBG2 datasheet(8/160 Pages) LODEV

Part #	L9D3256M72SBG2

Description	18-20 Gb, DDR3, 256 M x 72/80 Integrated Module

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Manufacturer	LODEV [LOGIC Devices Incorporated]

Direct Link	http://www.logicdevices.com

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LOGIC Devices Incorporated

www.logicdevices.com

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18-20 Gb, DDR3, 256 M x 72/80 Integrated Module

L9D3256M72SBG2

PRELIMINARY INFORMATION

L9D3256M80SBG2

July 24, 2013 LDS-L9D3256MxxSBG2 Rev B

High Performance, Integrated Memory Module Product

TABLE 2 - BALL/SIGNAL LOCATION AND DESCRIPTION CONTINUED

Ball Assignments

Symbol

Type

Description

M3

F2, F3

ODT

RESET\

DQSx,

DQSx\

DQ0, DQ1,

DQ2, DQ3,

DQ4, DQ5,

DQ6, DQ7

DQ8, DQ9,

DQ10, DQ11,

DQ12, DQ13,

DQ14, DQ15

DQ16, DQ17,

DQ18, DQ19,

DQ20, DQ21,

DQ22, DQ23

DQ24, DQ25,

DQ26, DQ27,

DQ28, DQ29,

DQ30, DQ31

DQ32, DQ33,

DQ34, DQ35,

DQ36, DQ37,

DQ38, DQ39

DQ40, DQ41,

DQ42, DQ43,

DQ44, DQ45,

DQ46, DQ47

Input

I/O

On-Die Termination:

RESET:

DD

Q.

Data Strobe, Byte (per WORD):

Data Input/Output:

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L9D3256M72SBG2 Datasheet(PDF) 8 Page - LOGIC Devices Incorporated

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