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DRV103UG4 Datasheet(PDF) 11 Page - Burr-Brown (TI) |
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DRV103UG4 Datasheet(HTML) 11 Page - Burr-Brown (TI) |
11 / 24 page DRV103 11 SBVS029A PACKAGE MOUNTING Figure 12 provides recommended PCB layouts for both the SO-8 (U) and the PowerPAD™ SO-8 (H) packages. Al- though the metal pad of the PowerPAD™ SO-8 (H) package is electrically connected to ground (pin 4), no current should flow in this pad. Do NOT use the exposed metal pad as a power ground connection or erratic operation will result. For lowest overall thermal resistance, it is best to solder the PowerPAD™ directly to a circuit board, as illustrated in Figure 13. Increasing the “heat sink” copper area improves heat dissipation. Figure 14 shows typical junction-to-ambi- ent thermal resistance as a function of the PC board copper area. POWER DISSIPATION DRV103 power dissipation depends on power supply, signal, and load conditions. Power dissipation (PD) is equal to the product of output current times the voltage across the conduct- ing DMOS transistor times the duty cycle. Using the lowest possible duty cycle necessary to assure the required hold force can minimize power dissipation in both the load and in the DRV103. For low current, the output DMOS transistor on- resistance is 0.5 Ω, increasing to 0.6Ω at high output current. At very high oscillator frequencies, the energy in the DRV103’s linear rise and fall times can become significant and cause an increase in PD. Application Bulletin SBFA002 at www.ti.com, explains how to calculate or measure power dissipation with unusual signals and loads. THERMAL PROTECTION Power dissipated in the DRV103 will cause its internal junction temperature to rise. The DRV103 has an on-chip thermal shutdown circuitry that protects the IC from damage. The thermal protection circuitry disables the output when the junc- tion temperature reaches approximately +160 °C, allowing the device to cool. When the junction temperature cools to approxi- mately +140 °C, the output circuitry is again enabled. Depend- ing on load and signal conditions, the thermal protection circuit may cycle on and off. This limits the dissipation of the driver but may have an undesirable effect on the load. Any tendency to activate the thermal protection circuit indi- cates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to +125 °C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered. Use worst-case load and signal conditions. For good reliability, thermal protection should trigger more than 40 °C above the maximum expected ambient condition of your application. This produces a junction temperature of 125 °C at the maxi- mum expected ambient condition. THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 80 70 60 50 40 30 012345 Copper Area (inches2) DRV103 (H) Power PAD Surface-Mount Package 1oz. copper FIGURE 12. Recommended PCB Layout. FIGURE 13. PowerPAD Heat Transfer. FIGURE 14. Heat Sink Thermal Resistance vs Circuit Board Copper Area. 150 (ref) C - C 215 (ref) 95 x 95 DRV103(H) Package 60 (ref) 50 nom 18 22 273 277 153 158 Copper Traces Signal Trace Copper Pad Thermal Vias DRV103 Die Pad-to-Board Solder |
Similar Part No. - DRV103UG4 |
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Similar Description - DRV103UG4 |
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