NTLUS4C12N

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6

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS

MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS

THE TERMINALS.

5. CENTER TERMINAL LEAD IS OPTIONAL. CENTER TERMINAL

IS CONNECTED TO TERMINAL LEAD # 4.

6. LEADS 1, 2, 5 AND 6 ARE TIED TO THE FLAG.

PLANE

D

B

E

0.10 C

A3

A

A1

0.10 C

UDFN6 2x2, 0.65P

CASE 517BG

ISSUE A

DIM

A

MIN

MAX

MILLIMETERS

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.25

0.35

b1

0.65 BSC

D

D2

E

E2

0.27 BSC

e

0.15 REF

K

L

PIN ONE

REFERENCE

0.08 C

0.10 C

NOTE 4

A

0.10 C

NOTE 3

L

e

D2

E2

b

B

3

6

6X

1

K

4

6X

0.05 C

J

J1

A

0.10 C

b1

B

0.05 C

L2

NOTE 5

L2

J

J1

0.51

0.61

2.00 BSC

1.00

1.20

2.00 BSC

1.10

1.30

0.65 BSC

0.20

0.30

0.20

0.30

BOTTOM VIEW

MOUNTING FOOTPRINT*

RECOMMENDED

DIMENSIONS: MILLIMETERS

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTIONS

PLATING

6X

0.43

2.30

1.10

0.66

1.25

0.65

PITCH

6X

0.35

1

PACKAGE

OUTLINE

0.35

0.34

0.60

L1

---

0.10

TOP VIEW

DETAIL B

SIDE VIEW

DETAIL A

A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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NTLUS4C12N/D

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