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THS3001CDRG4 Datasheet(PDF) 2 Page - Texas Instruments

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Part # THS3001CDRG4
Description  420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

THS3001CDRG4 Datasheet(HTML) 2 Page - Texas Instruments

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THS3001
SLOS217H – JULY 1998 – REVISED SEPTEMBER 2009................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS(1)
PACKAGED DEVICE
TRANSPORT MEDIA,
EVALUATION
TA
SOIC
MSOP
MSOP
QUANTITY
MODULE
(D)
(DGN)
SYMBOL
THS3001CD
THS3001CDGN
Rails, 75
THS3001EVM
ADP
THS3001CDR
THS3001CDGNR
Tape and Reel, 2500
--
0°C to 70°C
THS3001HVCDGN
Rails, 75
--
BNK
THS3001HVCDGNR
Tape and Reel, 2500
--
THS3001ID
THS3001IDGN
Rails, 75
--
ADQ
THS3001IDR
THS3001IDGNR
Tape and Reel, 2500
--
-40°C to 85°C
THS3001HVIDGN
Rails, 75
--
BNJ
THS3001HVIDGNR
Tape and Reel, 2500
--
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
THS3001
THS3001HV
UNITS
VSS
Supply voltage, VCC+ to VCC-
33
37
V
VI
Input voltage
±VCC
±VCC
V
IO
Output current
175
175
mA
VID
Differential input voltage
±6
±6
V
Continuous total power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature (2)
150
150
°C
TJ
Maximum junction temperature, continuous operation, long term reliability(3)
125
125
°C
THS3001C,
0 to 70
0 to 70
°C
THS3001HVC
TA
Operating free-air temperature
THS3001I,
–40 to 85
–40 to 85
°C
THS3001HVI
Tstg
Storage temperature
–65 to 125
–65 to 125
°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
(3)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
DISSIPATION RATING TABLE
POWER RATING (2)
θJC
θJA
(1)
PACKAGE
(°C/W)
(°C/W)
TA ≤ 25°C
TA = 85°C
D (8)
38.3
97.5
1.02 W
410 mW
DGN (8)
4.7
58.4
1.71 W
685 mW
(1)
This data was taken using the JEDEC standard High-K test PCB.
(2)
Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
2
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Copyright © 1998–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3001


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