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LTC3526 Datasheet(PDF) 6 Page - Linear Integrated Systems |
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LTC3526 Datasheet(HTML) 6 Page - Linear Integrated Systems |
6 / 16 page LTC3526/LTC3526B 3526bfd SW(Pin1):SwitchPin.ConnectinductorbetweenSWand VIN. Keep PCB trace lengths as short and wide as possible to reduce EMI. If the inductor current falls to zero or SHDN is low, an internal anti-ringing switch is connected from SW to VIN to minimize EMI. GND (Pin 2): Signal and Power Ground. Provide a short direct PCB path between GND and the (–) side of the input and output capacitors. VIN (Pin 3): Input Supply Pin. Connect a minimum of 1µF ceramic decoupling capacitor from this pin to ground using short direct PCB traces. SHDN (Pin 4): Logic Controlled Shutdown Input. There is an internal 4M Ω pull-down on this pin. • SHDN = High: Normal operation • SHDN = Low: Shutdown, quiescent current < 1µA FB (Pin 5): Feedback Input to the gm Error Amplifier. Con- nect resistor divider tap to this pin. The top of the divider connects to the output capacitor, the bottom of the divider connectstoGND.ReferringtotheBlockDiagram,theoutput voltage can be adjusted from 1.6V to 5.25V by: V V R R OUT = + 1 195 1 2 1 . • VOUT(Pin6):Outputvoltagesenseanddrainoftheinternal synchronous rectifier. PCB trace from VOUT to the output filter capacitor (4.7µF minimum) should be as short and wide as possible. GND (Exposed Pad Pin 7): The Exposed Pad must be sol- dered to the PCB ground plane. It serves as an additional ground connection and as a means of conducting heat away from the package. Load Step Response (from Burst Mode Operation) Load Step Response (Fixed Frequency) LOAD CURRENT 50mA/DIV 100µs/DIV VIN = 1.2V VOUT = 3.3V 50mA TO 100mA STEP COUT = 10µF 3526 G21 VOUT 100mV/DIV AC-COUPLED LOAD CURRENT 50mA/DIV 50µs/DIV VIN = 1.2V VOUT = 3.3V 5mA TO 100mA STEP COUT = 10µF 3526 G22 VOUT 100mV/DIV AC-COUPLED Typical perFormance characTerisTics elecTrical characTerisTics |
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