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W25Q32FVZPIG Datasheet(PDF) 91 Page - Winbond |
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W25Q32FVZPIG Datasheet(HTML) 91 Page - Winbond |
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91 / 99 page  W25Q32FV Publication Release Date: Sept 16,, 2013 - 90 - Revision H 10.4 8-Pad WSON 8x6-mm (Package Code ZE) Symbol Millimeters Inches Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.35 0.40 0.48 0.014 0.016 0.019 C --- 0.20 REF --- --- 0.008 REF --- D 7.90 8.00 8.10 0.311 0.315 0.319 D2 3.35 3.40 3.45 0.132 0.134 0.136 E 5.90 6.00 6.10 0.232 0.236 0.240 E2 4.25 4.30 4.35 0.167 0.169 0.171 e --- 1.27 --- --- 0.050 --- L 0.45 0.50 0.55 0.018 0.020 0.022 y 0.00 --- 0.050 0.000 --- 0.002 Note: 1.The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad. |
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