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Subject to change without notice.

www.cree.com

FEATURES

• DirectAttachLEDTechnology

• RectangularLEDRFPerformance

– 450&460nm–485mWmin

• HighReliability-EutecticAttach

• LowForwardVoltage(Vf)–3.15VTypicalat350mA

• MaximumDCForwardCurrent–1000mA

• InGaNJunction-DownDesignforImprovedThermal

Management

• NoWireBondsRequired

APPLICATIONS

• GeneralIllumination

− Aircraft

− DecorativeLighting

− TaskLighting

− OutdoorIllumination

• WhiteLEDs

• CameraFlash

• ProjectionDisplays

• Automotive

Direct Attach DA1000™ LEDs

CxxxDA1000-Sxx000

Data Sheet

Cree’sDirectAttachDA1000LEDsarethenextgenerationofsolid-stateLEDemittersthatcombinehighlyefficient

InGaNmaterialswithCree’sproprietarydevicetechnologyandsilicon-carbidesubstratestodeliversuperiorvaluefor

thegeneral-illuminationmarket.TheDA1000LEDsareamongthebrightestinthelightingmarketwhiledelivering

alowforwardvoltage,resultinginaverybrightandhighlyefficientsolution.Thebondpad-downdesignallowsfor

a eutectic direct die-attach process, eliminating the need for wire bonds, and enables superior performance from

improvedthermalmanagement.

CxxxDA1000-Sxx000 Chip Diagram

Top View

Bottom View

Die Cross Section

Anode(+)

945x75μm

DA1000LED

1000x1000μm

t=335μm

Cathode(-)

945x795μm

Gap75μm