Copyright©2011Cree,Inc.Allrightsreserved.Theinformationinthisdocumentissubjecttochangewithoutnotice.Creeandthe

Creelogoareregisteredtrademarks,andDAandDA700aretrademarksofCree,Inc.

2

CPR3EU Rev. -

Cree,Inc.

4600SiliconDrive

Durham,NC27703

USATel:+1.919.313.5300

www.cree.com

Maximum Ratings at T

Notes 1, 2 & 3

CxxxDA700-Sxx000

DCForwardCurrent

750mA

PeakForwardCurrent(1/10dutycycle@1kHz)

1000mA

LEDJunctionTemperature

150°C

ReverseVoltage

5V

OperatingTemperatureRange

-40°Cto+100°C

StorageTemperatureRange

-40°Cto+100°C

Typical Electrical/Optical Characteristics at T

Note 2

Part Number

Forward Voltage (V

Reverse Current

[I(Vr=5V), μA]

Full Width Half Max

(

λ

Min.

Typ.

Max.

Max.

Typ.

C450DA700-Sxx000

2.9

3.3

3.5

2

20

C460DA700-Sxx000

2.9

3.3

3.5

2

21

Mechanical Specifications

CxxxDA700-Sxx000

Description

Dimension

Tolerance

P-NJunctionArea(μm)

645x645

±35

ChipBottomArea(μm)

700x700

±35

ChipTopArea(μm)

340x340

±35

ChipThickness(μm)

335

±25

AuSnBondPadWidth–Anode(um)

75

±15

AuSnBondPadLength–Anode(um)

645

±35

AuSnBondPadWidth–Cathode(um)

495

±35

AuSnBondPadLength–Cathode(um)

645

±35

BondPadGap(μm)

75

±15

AuSnBondPadThickness(μm)

3

±0.5

Notes:

1.

Maximum ratings are package-dependent. The above ratings were determined using a Cree 3.45-mm x 3.45-mm SMT package (with silicone

encapsulation and intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be

characterizedinaspecificpackagetodeterminelimitations.Assemblyprocessingtemperaturemustnotexceed325°C(<5seconds).

2.

Allproductsconformtothelistedminimumandmaximumspecificationsforelectricalandopticalcharacteristicswhenassembledandoperatedat350

mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgivenarewithintherangeofaveragevalues

expectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.AllmeasurementsweremadeusinglampsinT-1¾packages(with

HysolOS4000epoxyencapsulantandintrinsicAuSnmetaldieattach).OpticalcharacteristicsmeasuredinanintegratingsphereusingIlluminanceE.

3.

ThemaximumforwardcurrentisdeterminedbythethermalresistancebetweentheLEDjunctionandambient.Itiscrucialfortheend-producttobe

designedinamannerthatminimizesthethermalresistancefromtheLEDjunctiontoambientinordertooptimizeproductperformance.

0

100

200

300

400

500

600

700

800

25

50

75

100

125

150

175

Ambient Temperature (

C)