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GC0350C0J1R0CL Datasheet(PDF) 55 Page - Murata Manufacturing Co., Ltd. |
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GC0350C0J1R0CL Datasheet(HTML) 55 Page - Murata Manufacturing Co., Ltd. |
55 / 67 page C03E.pdf May.17,2013 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 53 Solder Amount in section 4-3. Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board. Preheating conditions (the "Temperature of the Soldering Iron Tip," "Preheating Temperature," and "Temperature Differential" between the iron tip and the components and the PCB), should be within the conditions of table 3. It is required to keep the temperature differential between the soldering iron and the component surfaces ( ΔT) as low as possible. 2. After soldering, do not allow the component/PCB to cool down rapidly. 3. The operating time for the re-working should be as short as possible. When re-working time is too long, it may cause solder leaching, resulting in a reduction in the adhesive strength of the terminations. 4. Optimum solder amount when re-working with a soldering iron 4-1. In the case of sizes smaller than 0603, (GC3/GCD/ GCE/GCJ/GCM Series, 03/15/18 sizes), the top of the solder fillet should be lower than 2/3 of the thickness of the component or 0.5mm, whichever is smaller. In the case of 0805 and larger sizes, (GC3/ GCD/GCE/GCJ/GCM Series, 21/31/32/43/55 sizes), the top of the solder fillet should be lower than 2/3 of the thickness of the component. If the solder amount is excessive, the risk of cracking is higher during board bending or under any other stressful condition. 4-2. A soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering iron from touching the components during the re-work. 4-3. Solder wire with ø0.5mm or smaller is required for soldering. <Applicable to KC3/KCM Series> 5. For the shape of the soldering iron tip, refer to the figure on the right. Regarding the type of solder, use a wire diameter of ø0.5mm or less (rosin core wire solder). How to Apply the Soldering Iron Apply the tip of the soldering iron against the lower end of the metal terminal. 1) In order to prevent cracking caused by sudden heating of the ceramic device, do not touch the ceramic base directly. 2) In order to prevent deviations and dislocating of the chip, do not touch the junction of the chip and the metal terminal, and the metal portion on the outside directly. Appropriate Amount of Solder The amount of solder for corrections by soldering iron, should be lower than the height of the lower side of the chip. GC3/GCD/GCE/ GCJ/GCM Series 03/15/18/21/31 sizes GCJ/GCM Series 32/43/55 sizes ΔTV190°C ΔTV130°C Part Number Temperature Differential ( ΔT) Table 3 Continued from the preceding page. Air Air Atmosphere 350°C max. 280°C max. Temperature of Soldering Iron Tip 150°C min. 150°C min. Preheating Temperature *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Continued on the following page. Cross Section 17 26 (in mm) R0.5 Apply the tip of the soldering iron only on the terminal portion, without touching the body of the chip. Tip of Soldering Iron Tip temperature: 350°C or less/ 5 sec. or less/60W or less Copper Land Wire Solder !Caution |
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