C03E.pdf

May.17,2013

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

58

Chip Capacitor

Continued from the preceding page.

Continued on the following page.

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress of

PCB bending, etc. if the land area is larger than

needed and has an excess amount of solder.

Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering.

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Solder Resist

a

b

c

Land

2. Adhesive Application

1. Thin or insufficient adhesive can cause the chips to

loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c,

shown in the drawing at right, to obtain the correct

bonding strength.

The chip's electrode thickness and land thickness must

also be taken into consideration.

2. Low viscosity adhesive can cause chips to slip after

mounting. The adhesive must have a viscosity of

5000Pa s (500ps) min. (at 25°C).

3. Adhesive Coverage

Land

Adhesive

Board

Chip Capacitor

a

b

c

c=50 to 105μm

b=30 to 35μm

a=20 to 70μm

*Nominal Value

GC3/GCD/GCM/GCJ18

(Rated Voltage: above 250VDC (for GCJ18 alone))

GC3/GCD/GCM/GCJ21

(Rated Voltage: above 250VDC (for GCJ21 alone))

GC3/GCD/GCM/GCJ31

(Rated Voltage: above 250VDC (for GCJ31 alone))

1.6

g0.8

2.0

g1.25

3.2

g1.6

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.8 to 0.9

0.9 to 1.0

1.0 to 1.1

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

GC3/GCD/GCE/GCJ/GCM03

GC3/GCD/GCE/GCJ/GCM15

GC3/GCD/GCE/GCJ/GCM18

GC3/GCD/GCE/GCJ/GCM21

GC3/GCD/GCE/GCJ/GCM31

GC3/GCD/GCE/GCJ/GCM32

GC3/GCD/GCE/GCJ/GCM43

GC3/GCD/GCE/GCJ/GCM55

0.6

g0.3

1.0

g0.5

1.6

g0.8

2.0

g1.25

3.2

g1.6

3.2

g2.5

4.5

g3.2

5.7

g5.0

0.2 to 0.3

0.3 to 0.5

0.6 to 0.8

1.0 to 1.2

2.2 to 2.4

2.0 to 2.4

3.0 to 3.5

4.0 to 4.6

0.2 to 0.35

0.35 to 0.45

0.6 to 0.7

0.6 to 0.7

0.8 to 0.9

1.0 to 1.2

1.2 to 1.4

1.4 to 1.6

0.2 to 0.4

0.4 to 0.6

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

1.8 to 2.3

2.3 to 3.0

3.5 to 4.8

(in mm)

Part Number

Dimensions

Chip (L

gW)

a

b

c

Table 1 Flow Soldering Method

(in mm)

Chip (L

gW)

a

b

c

Table 2 Reflow Soldering Method

KC3/KCM55

5.7

g5.0

2.6

2.7

5.6

(in mm)

<Applicable to Part Number KC3/KCM>

1.6

g0.8

2.0

g1.25

3.2

g1.6

0.05mg min.

0.1mg min.

0.15mg min.

Size (L

gW)

Adhesive Coverage*

Flow soldering can only be used for products with a chip size of 3.2x1.6mm or less.

Part Number

Dimensions

Chip (L

gW)

a

b

c

Part Number

Dimensions

Notice