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GC0351C0JR50BL Datasheet(PDF) 59 Page - Murata Manufacturing Co., Ltd. |
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GC0351C0JR50BL Datasheet(HTML) 59 Page - Murata Manufacturing Co., Ltd. |
59 / 67 page C03E.pdf May.17,2013 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 57 1. Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor. 1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper operating temperature or less when including the self-heating factors. 2. Atmosphere Surroundings (gaseous and liquid) 1. Restriction on the operating environment of capacitors. 1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor. 1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation. 1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents for long periods of time. 3. Piezo-electric Phenomenon 1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor, noise may occur. c Rating c Soldering and Mounting 1. PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height. 1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is different depending on PCB material and structure. Especially metal PCB such as alumina has a greater risk of chip crack because of the large difference in thermal expansion coefficient. In case of a chip below 0402 size, there is also the same possibility of cracking with a single-layered glass epoxy board. Chassis Solder (ground) Electrode Pattern Solder Resist Solder Resist Solder Resist Lead Wire Soldering Iron Lead Wire Solder Resist Pattern Forms Placing Close to Chassis Placing of Chip Components and Leaded Components Placing of Leaded Components after Chip Component Lateral Mounting Prohibited Correct Continued on the following page. Notice |
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