C03E.pdf

May.17,2013

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

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1. Please evaluate the capacitor using actual cleaning

equipment and conditions to confirm the quality, and

select the solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or

other foreign substances, causing deterioration of

electrical characteristics and the reliability of the

capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or

insufficient) may result in deterioration of the

performance of the capacitors.

6. Washing

Continued from the preceding page.

4. Flux Application

1. An excessive amount of flux generates a large quantity of

flux gas, which can cause a deterioration of solder ability,

so apply flux thinly and evenly throughout. (A foaming

system is generally used for flow soldering.)

2. Flux containing too high a percentage of halide may

cause corrosion of the outer electrodes unless there is

sufficient cleaning. Use flux with a halide content of 0.1%

max.

3. Do not use strong acidic flux.

4. Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non-rosin type flux

including wash-type flux and non-wash-type flux.)

o Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown at right) and 25% of the length A-B shown as

mounted on substrate.

[As a Single Chip]

[As Mounted on Substrate]

5. Flow Soldering

A

B

C

D

Outer Electrode

A

B

3. Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to

disconnect during flow soldering and causes deterioration

in the insulation resistance between the outer electrodes

due to moisture absorption.

Control curing temperature and time in order to prevent

insufficient hardening.

Notice