Electronic Components Datasheet Search |
|
GC0350C0JR50BL Datasheet(PDF) 61 Page - Murata Manufacturing Co., Ltd. |
|
GC0350C0JR50BL Datasheet(HTML) 61 Page - Murata Manufacturing Co., Ltd. |
61 / 67 page C03E.pdf May.17,2013 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 59 1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the solvent for cleaning. 2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 3. Select the proper cleaning conditions. 3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors. 6. Washing Continued from the preceding page. 4. Flux Application 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solder ability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering.) 2. Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless there is sufficient cleaning. Use flux with a halide content of 0.1% max. 3. Do not use strong acidic flux. 4. Do not use water-soluble flux.* (*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.) o Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as mounted on substrate. [As a Single Chip] [As Mounted on Substrate] 5. Flow Soldering A B C D Outer Electrode A B 3. Adhesive Curing 1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes deterioration in the insulation resistance between the outer electrodes due to moisture absorption. Control curing temperature and time in order to prevent insufficient hardening. Notice |
Similar Part No. - GC0350C0JR50BL |
|
Similar Description - GC0350C0JR50BL |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |