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MP28248 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP28248 Datasheet(HTML) 2 Page - Monolithic Power Systems |
2 / 19 page MP28248 – 3A, 4.2V-20V INPUT, FAST-TRANSIENT SYNCHRONOUS STEP-DOWN CONVERTER IN QFN12 (2X3mm) MP28248 Rev 1.0 www.MonolithicPower.com 2 1/5/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MP28248GD* QFN12 (2x3mm) ACR *For Tape & Reel, add suffix –Z (e.g. MP28248GD–Z). PACKAGE REFERENCE GND SW BST VCC EN GND SW IN FREQ FB TOP VIEW SS GND 1 2 12 3 4 8 7 6 5 11 10 9 SW QFN12 (2x3mm) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ....................................... 22V VSW..................................... -0.3V to (VIN + 0.3V) VBS ....................................................... VSW + 6V IVIN (RMS)........................................................ 3.5A All Other Pins..................................-0.3V to +6V Continuous Power Dissipation (TA = 25°C) (2) QFN12 (2X3mm)........................................ 1.8W Junction Temperature ..............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ...........................4.2V to 20V Output Voltage VOUT.....................0.815V to 13V Maximum Junction Temp. (TJ) ... -40°C to 125°C Thermal Resistance (4) θJA θJC QFN12 (2mmx3mm)............... 70 ...... 15... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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