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AMS302T Datasheet(PDF) 5 Page - Panasonic Semiconductor |
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AMS302T Datasheet(HTML) 5 Page - Panasonic Semiconductor |
5 / 6 page Light Sensor (AMS1, 3, 4) 11. The following shows the packaging format 1) SMD type tape and reel (mm inch) Type Tape dimensions Dimensions of tape reel Light sensor NaPiCa SMD type AMS104Y Note) When picked from 1 and 4-pin side (Please inquire for tape and reel packaging with 2-pin and 3-pin on the pull-out side.) 5. Recommended soldering conditions <SMD/Chip type> 1) Recommended condition (1) IR (Infrared reflow) soldering method T1 = 150 to 180 °C 302 to 356°F T2 = 230 °C 446°F T3 = 250 °C 482°F or less t1 = 60 to 120 s or less t2 = 30 s or less (2) Soldering iron method Tip temperature: 350 to 400 °C 662 to 752 °F Wattage: 30 to 60 W Soldering time: within 3 s *We don’t recommend soldering iron method for chip type. 2) Do not do flow soldering. <Through-hole type> 1) Recommended condition (1) Double wave soldering method T1 = 120 °C 248°F T2 = 260 °C 500°F or less t1 = 120 s or less t2+t3= 6 s or less (2) Soldering iron method Tip temperature: 350 to 400 °C 662 to 752 °F Wattage: 30 to 60 W Soldering time: within 3 s 2) The soldered position on leads should not be closer than 3mm .118inch to the molding resin of this sensor. 6. Notes for mounting 1) Temperature rise in the lead portion is highly dependent on package size. If multiple different packages are mounted on the same board, please check your board beforehand in an actual product, ensuring that the temperature of the solder area of the sensor terminals falls within the temperature conditions of item 5. 2) If the mounting conditions exceed the recommended solder conditions in item 5, resin strength will fall and the mismatching of the heat expansion coefficient of each constituent material will increase markedly, possibly causing cracks in the package, disconnections of bonding wires, and the like. For this reason, please inquire with us about whether this use is possible. 7. Cleaning solvents compatibility We recommend dip cleaning with an organic solvent for removal of solder flux etc. If you cannot avoid using ultrasonic cleansing, please ensure that the following conditions are met, and check beforehand for defects. •Frequency: 27 to 29 kHz • Ultrasonic power: No greater than 0.25W/cm2 • Cleaning time: No longer than 30 s • Cleanser used: Asahiklin AK-225 • Other: Submerge in solvent in order to prevent the PCB and sensors from being contacted directly by the ultrasonic vibrations. Note: Applies to unit area ultrasonic power for ultrasonic baths. 8. Transportation Extreme vibration during transport will warp the lead or damage the sensor. Handle the outer and inner boxes with care. 9. Avoid using the sensor in environments containing excessive amounts of steam, dust, corrosive gas, or where organic solvents are present. 10. Lead forming and cutting of through-hole type 1) Lead forming must be done at normal temperature before soldering 2) The bent and cut position on leads should not be closer than 3mm .118inch to the base of leads. 3) Lead forming and cutting must be done while fixing the base of leads. 4) Avoid mounting with stress at the base of leads. T1 T2 T3 t1 t2 T1 T2 t1 t2 t3 Device mounted on tape Direction of picking 8.0±0.2 1.0±0.1 dia. 1.5 dia. 4.0±0.1 2.0±0.1 2.4±0.1 4.0±0.1 1.75±0.1 3.5±0.1 3.6±0.1 1.5±0.3 0.2±0.05 +0.1 −0 .059 dia. +.004 −0 Cathode side Anode side .008±.002 .059±.012 .142±.004 .094±.004 .157±.004 .157±.004 .079±.004 .039±.004 dia. .069±.004 .315±.008 .138±.004 60±0.5 dia. 2.0±0.5 178±2 dia. 11.4±1.0 9.0±0.3 21.0±0.8 dia. 13.0±0.5 dia. .079±.020 .827±.031 dia. .512±.020 dia. .449±.039 7.008±.079 dia. 2.362±.020 dia. .354±.012 ASCTB242E 201209-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e |
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