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AMS302T Datasheet(PDF) 5 Page - Panasonic Semiconductor

Part # AMS302T
Description  Photo IC type high sensitive light sensor
Download  6 Pages
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AMS302T Datasheet(HTML) 5 Page - Panasonic Semiconductor

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Light Sensor (AMS1, 3, 4)
11. The following shows the packaging format
1) SMD type tape and reel (mm inch)
Type
Tape dimensions
Dimensions of tape reel
Light sensor
NaPiCa
SMD type
AMS104Y
Note) When picked from 1 and 4-pin side
(Please inquire for tape and reel packaging with 2-pin and 3-pin on the
pull-out side.)
5. Recommended soldering
conditions
<SMD/Chip type>
1) Recommended condition
(1) IR (Infrared reflow) soldering method
T1 = 150 to 180
°C 302 to 356°F
T2 = 230
°C 446°F
T3 = 250
°C 482°F or less
t1 = 60 to 120 s or less
t2 = 30 s or less
(2) Soldering iron method
Tip temperature: 350 to 400
°C 662 to
752
°F
Wattage: 30 to 60 W
Soldering time: within 3 s
*We don’t recommend soldering iron
method for chip type.
2) Do not do flow soldering.
<Through-hole type>
1) Recommended condition
(1) Double wave soldering method
T1 = 120
°C 248°F
T2 = 260
°C 500°F or less
t1 = 120 s or less
t2+t3= 6 s or less
(2) Soldering iron method
Tip temperature: 350 to 400
°C 662 to
752
°F
Wattage: 30 to 60 W
Soldering time: within 3 s
2) The soldered position on leads should
not be closer than 3mm .118inch to the
molding resin of this sensor.
6. Notes for mounting
1) Temperature rise in the lead portion is
highly dependent on package size.
If multiple different packages are
mounted on the same board, please
check your board beforehand in an actual
product, ensuring that the temperature of
the solder area of the sensor terminals
falls within the temperature conditions of
item 5.
2) If the mounting conditions exceed the
recommended solder conditions in item
5, resin strength will fall and the
mismatching of the heat expansion
coefficient of each constituent material
will increase markedly, possibly causing
cracks in the package, disconnections of
bonding wires, and the like. For this
reason, please inquire with us about
whether this use is possible.
7. Cleaning solvents compatibility
We recommend dip cleaning with an
organic solvent for removal of solder flux
etc. If you cannot avoid using ultrasonic
cleansing, please ensure that the
following conditions are met, and check
beforehand for defects.
•Frequency: 27 to 29 kHz
• Ultrasonic power: No greater than
0.25W/cm2
• Cleaning time: No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other:
Submerge in solvent in order to prevent
the PCB and sensors from being
contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic power for
ultrasonic baths.
8. Transportation
Extreme vibration during transport will
warp the lead or damage the sensor.
Handle the outer and inner boxes with
care.
9. Avoid using the sensor in
environments containing excessive
amounts of steam, dust, corrosive
gas, or where organic solvents are
present.
10. Lead forming and cutting of
through-hole type
1) Lead forming must be done at normal
temperature before soldering
2) The bent and cut position on leads
should not be closer than 3mm .118inch
to the base of leads.
3) Lead forming and cutting must be
done while fixing the base of leads.
4) Avoid mounting with stress at the base
of leads.
T1
T2
T3
t1
t2
T1
T2
t1
t2
t3
Device
mounted
on tape
Direction of
picking
8.0±0.2
1.0±0.1 dia.
1.5
dia.
4.0±0.1
2.0±0.1
2.4±0.1
4.0±0.1
1.75±0.1
3.5±0.1
3.6±0.1
1.5±0.3
0.2±0.05
+0.1
−0
.059
dia.
+.004
−0
Cathode side
Anode side
.008±.002
.059±.012
.142±.004
.094±.004
.157±.004
.157±.004
.079±.004
.039±.004 dia.
.069±.004
.315±.008
.138±.004
60±0.5 dia.
2.0±0.5
178±2 dia.
11.4±1.0
9.0±0.3
21.0±0.8 dia.
13.0±0.5 dia.
.079±.020
.827±.031 dia.
.512±.020 dia.
.449±.039
7.008±.079 dia.
2.362±.020 dia.
.354±.012
ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e


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