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UMK107B7474A Datasheet(PDF) 50 Page - Taiyo Yuden (U.S.A.), Inc

Part No. UMK107B7474A
Description  Notice for TAIYO YUDEN products
Download  51 Pages
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Maker  TAIYO-YUDEN [Taiyo Yuden (U.S.A.), Inc]
Homepage  http://www.t-yuden.com/
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UMK107B7474A Datasheet(HTML) 50 Page - Taiyo Yuden (U.S.A.), Inc

 
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11
mlcc_prec-P3
mlcc_prec_e-01
PRECAUTIONS
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
(1)Flux used shall be less than or equal to 0.1 wt%(in CI equivalent)of halogenated content. Flux having a strong acidity content shall not be applied.
(2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
(3)When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance(Chlorine, etc.)content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
(Chlorine, etc.)content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
Chlorine, etc.)content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
)content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
[Reflow soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
0
100
200
300
230℃
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
[Wave soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
[Hand soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
0
100
200
300
0
100
200
300
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230∼250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230∼280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
0
100
200
300
400
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling
Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
⊿T
316type or less
⊿T≦150℃
⊿T
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.


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