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A3P015 Datasheet(PDF) 19 Page - Microsemi Corporation |
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A3P015 Datasheet(HTML) 19 Page - Microsemi Corporation |
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19 / 220 page  ProASIC3 Flash Family FPGAs Revision 13 2-5 Package Thermal Characteristics The device junction-to-case thermal resistivity is jc and the junction-to-ambient air thermal resistivity is ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction temperature is 100°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and in still air. EQ 2 Maximum Power Allowed Max. junction temp. ( C) Max. ambient temp. (C) – ja(C/W) ------------------------------------------------------------------------------------------------------------------------------------------ 100 C70C – 20.5 C/W ------------------------------------- 1.463 W · = = = Table 2-5 • Package Thermal Resistivities Package Type Device Pin Count jc ja Units Still Air 200 ft./min. 500 ft./min. Quad Flat No Lead A3P030 132 0.4 21.4 16.8 15.3 C/W A3P060 132 0.3 21.2 16.6 15.0 C/W A3P125 132 0.2 21.1 16.5 14.9 C/W A3P250 132 0.1 21.0 16.4 14.8 C/W Very Thin Quad Flat Pack (VQFP) All devices 100 10.0 35.3 29.4 27.1 C/W Thin Quad Flat Pack (TQFP) All devices 144 11.0 33.5 28.0 25.7 C/W Plastic Quad Flat Pack (PQFP) All devices 208 8.0 26.1 22.5 20.8 C/W PQFP with embedded heatspreader All devices 208 3.8 16.2 13.3 11.9 C/W Fine Pitch Ball Grid Array (FBGA) See note* 144 3.8 26.9 22.9 21.5 C/W See note* 256 3.8 26.6 22.8 21.5 C/W See note* 484 3.2 20.5 17.0 15.9 C/W A3P1000 144 6.3 31.6 26.2 24.2 C/W A3P1000 256 6.6 28.1 24.4 22.7 C/W A3P1000 484 8.0 23.3 19.0 16.7 C/W Note: *This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal information will be available in future revisions of the datasheet. |
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