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P1AFS15002 Datasheet(PDF) 6 Page - Microsemi Corporation

Part No. P1AFS15002
Description  Terrestrial FPGA and SoC Product Catalog
Download  27 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

P1AFS15002 Datasheet(HTML) 6 Page - Microsemi Corporation

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Extended Temperature Fusion Devices
AFS600
AFS1500
Cortex-M1Devices
M1AFS600
M1AFS1500
System Gates
600,000
1,500,000
Tiles(D–flip–flops)
13,824
38,400
AES-Protected ISP
Yes
Yes
PLLs
2
2
Globals
18
18
FlashMemoryBlocks(2Mbits)
2
4
TotalFlashMemoryBits
4 M
8 M
FlashROMBits
1,024
1,024
RAMBlocks(4,608bits)
24
60
RAM(kbits)
108
270
Analog Quads
10
10
Analog Input Channels
30
30
Gate Driver Outputs
10
10
I/OBanks(+JTAG)
5
5
Maximum Digital I/Os
172
223
Analog I/Os
40
40
Package Pins
FG
FG256, FG484
FG256, FG484
Extended Temperature Fusion
Mixed signal integration at extended temperatures
Microsemi Fusion mixed signal FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and
high-performance, flash-based reprogrammable logic in a monolithic device. Innovative Fusion architecture can be used with Microsemi’s soft microcontroller (MCU)
core as well as the performance-maximized 32-bit ARM Cortex-M1 cores. Extended temperature Fusion devices operate at temperatures from 100ºC to as low
as -55ºC.
Extended Temperature Fusion Devices


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