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P1AFS15002 Datasheet(PDF) 6 Page - Microsemi Corporation |
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P1AFS15002 Datasheet(HTML) 6 Page - Microsemi Corporation |
6 / 27 page 6 www.microsemi.com/soc Extended Temperature Fusion Devices AFS600 AFS1500 Cortex-M1Devices M1AFS600 M1AFS1500 System Gates 600,000 1,500,000 Tiles(D–flip–flops) 13,824 38,400 AES-Protected ISP Yes Yes PLLs 2 2 Globals 18 18 FlashMemoryBlocks(2Mbits) 2 4 TotalFlashMemoryBits 4 M 8 M FlashROMBits 1,024 1,024 RAMBlocks(4,608bits) 24 60 RAM(kbits) 108 270 Analog Quads 10 10 Analog Input Channels 30 30 Gate Driver Outputs 10 10 I/OBanks(+JTAG) 5 5 Maximum Digital I/Os 172 223 Analog I/Os 40 40 Package Pins FG FG256, FG484 FG256, FG484 Extended Temperature Fusion Mixed signal integration at extended temperatures Microsemi Fusion mixed signal FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and high-performance, flash-based reprogrammable logic in a monolithic device. Innovative Fusion architecture can be used with Microsemi’s soft microcontroller (MCU) core as well as the performance-maximized 32-bit ARM Cortex-M1 cores. Extended temperature Fusion devices operate at temperatures from 100ºC to as low as -55ºC. Extended Temperature Fusion Devices |
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