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MP8761 Datasheet(PDF) 20 Page - Monolithic Power Systems

Part No. MP8761
Description  High Efficiency, 8A, 18V, Synchronous, Step-Down Converter
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP8761 Datasheet(HTML) 20 Page - Monolithic Power Systems

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MP8761 — 8A, 18V, SYNCHRONOUS STEP-DOWN CONVERTER
MP8761 Rev. 1.1
www.MonolithicPower.com
20
11/4/2013
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
LAYOUT RECOMMENDATIONS
1. MPS offers two packages, but recommends
MP8761GLE with its 16-pin QFN package for
all new designs due to its smaller parasitical
inductance.
2. Place high current paths (GND, IN, and SW)
very close to the device with short, direct and
wide traces.
3. The 13-pin QFN package requires two copper
IN
layers
for
better
performance.
Respectively put at least one decoupling
capacitor on both Top and Bottom layers and
as close to the IN and GND pins as possible.
Add several vias with 18mil and 8mil hole
diameters under the device and near the
input capacitors to help dissipate heat and to
reduce parasitic inductances.
4. Place a decoupling capacitor as close to the
VCC and AGND pins as possible.
5. Keep the switching node (SW) plane as small
as possible and far away from the feedback
network.
6. Place the external feedback resistors next to
the FB pin. Make sure that there are no vias
on the FB trace. The feedback resistors
should refer to AGND instead of PGND.
7. Keep the BST voltage path (BST, C3, and
SW) as short as possible.
8. MPS strongly recommends a four-layer layout
to improve thermal performance.
Figure 13: Schematic Reference for PCB Layout
IN
R3
R1
R3
R2
R3
R4
R3
C4
R3
C2
VIN
GND
SW
VOUT
PGND
PGND
SW
SW
R3
C5
R3
R3
GND
Top Layer
GND
Inner1 Layer
GND
Inner2 Layer


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