MP8736– HIGHEFFICIENCY,FAST TRANSIENT,6A, 19V SYNCHRONOUSBUCKCONVERTERIN ATINY3X4mmPACKAGE

MP8736 Rev. 1.34

www.MonolithicPower.com

22

4/18/2012

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Layout Recommendation

1. The high current paths (GND, IN, and SW)

should be placed very close to the device

with short, direct, and wide traces.

2. Put the input capacitors as close to the IN

and GND pins as possible.

3. Put the decoupling capacitor as close to the

VCC and GND pins as possible.

4. Keep the switching node SW short and away

from the feedback network.

5. The external feedback resistors should be

placed next to the FB pin. Make sure that

there is no via on the FB trace.

as short as possible.

7. Keep the bottom IN and SW pads connected

with large copper to achieve better thermal

performance.

8. Four-layer layout is strongly recommended to

achieve better thermal performance.

Top Layer

Inner1 Layer

Inner2 Layer

Bottom Layer

Figure 15—PCB Layout