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STM32W108HBU61 Datasheet(PDF) 5 Page - List of Unclassifed Manufacturers

Part # STM32W108HBU61
Description  High-performance, 802.15.4 wireless system-on-chip
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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STM32W108CB, STM32W108HB
Electrical characteristics
Doc ID 15851 Rev 1
5/20
2.2
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 2: Voltage characteristics,
Table 3: Current characteristics, and Table 4: Thermal characteristics may cause permanent
damage to the device. These are stress ratings only and functional operation of the device
at these conditions is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Table 2.
Voltage characteristics
Ratings
Min.
Max.
Unit
Regulator input voltage (VDD_PADS)
-0.3
+3.6
V
Analog, Memory and Core voltage (VDD_24MHZ, VDD_VCO,
VDD_RF, VDD_IF, VDD_PADSA, VDD_MEM, VDD_PRE,
VDD_SYNTH, VDD_CORE)
-0.3
+2.0
V
Voltage on RF_P,N; RF_TX_ALT_P,N
-0.3
+3.6
V
RF Input Power (for max level for correct packet reception see
Table 11: Receive characteristics) RX signal into a lossless balun
+15
dBm
Voltage on any GPIO (PA[7:0], PB[7:0], PC[7:0]), SWCLK, nRESET,
VREG_OUT
-0.3
VDD_PADS
+0.3
V
Voltage on BIAS_R, OSCA, OSCB
-0.3
VDD_PADSA
+0.3
V
Table 3.
Current characteristics
Symbol
Ratings
Max.
Unit
IVDD
Total current into VDD/VDDA power lines (source)
150
mA
IVSS
Total current out of VSS ground lines (sink)
150
IIO
Output current sunk by any I/O and control pin
25
Output current source by any I/Os and control pin
− 25
IINJ(PIN)
Injected current on NRST pin
± 5
Injected current on HSE OSC_IN and LSE OSC_IN pins
± 5
Injected current on any other pin
± 5
ΣIINJ(PIN)
Total injected current (sum of all I/O and control pins)
± 25
Table 4.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–40 to +140
°C
TJ
Maximum junction temperature
150
°C


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