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MCP1640T-ICHY Datasheet(PDF) 9 Page - Microchip Technology

Part No. MCP1640T-ICHY
Description  0.65V Start-up Synchronous Boost Regulator with True Output Disconnect or Input/Output Bypass Option
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP1640T-ICHY Datasheet(HTML) 9 Page - Microchip Technology

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 2010 Microchip Technology Inc.
DS22234A-page 9
MCP1640/B/C/D
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Switch Node Pin (SW)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 800 mA peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are inter-
nally connected at the SW node.
3.2
Ground Pin (GND)
The ground or return pin is used for circuit ground con-
nection. Length of trace from input cap return, output
cap return and GND pin should be made as short as
possible to minimize noise on the GND pin. In the
SOT23-6 package, a single ground pin is used.
3.3
Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable device switching and lower quiescent current
while disabled. A logic high (>90% of VIN) will enable
the regulator output. A logic low (<20% of VIN) will
ensure that the regulator is disabled.
3.4
Feedback Voltage Pin (FB)
The FB pin is used to provide output voltage regulation
by using a resistor divider. The FB voltage will be 1.21V
typical with the output voltage in regulation.
3.5
Output Voltage Pin (VOUT)
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation.
3.6
Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.
3.7
Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated VREF and error amplifier. In the 2x3 DFN
package, the SGND and power ground (PGND) pins are
connected externally.
3.8
Power Ground Pin (PGND)
The power ground pin is used as a return for the high-
current N-Channel switch. In the 2x3 DFN package, the
PGND and signal ground (SGND) pins are connected
externally.
3.9
Output Voltage Sense Pin (VOUTS)
The output voltage sense pin connects the regulated
output voltage to the internal bias circuits. In the 2x3
DFN package, VOUTS and VOUTP are connected
externally.
3.10
Output Voltage Power Pin (VOUTP)
The output voltage power pin connects the output volt-
age to the switch node. High current flows through the
integrated P-Channel and out of this pin to the output
capacitor and output. In the 2x3 DFN package, VOUTS
and VOUTP are connected externally.
3.11
Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the PGND and SGND
pins. They must be connected to the same potential on
the Printed Circuit Board (PCB).
Pin No.
MCP1640/B/C/D
SOT23
MCP1640/B/C/D
2x3 DFN
Description
SW
1
5
Switch Node, Boost Inductor Input Pin
GND
2
Ground Pin
EN
3
4
Enable Control Input Pin
FB
4
1
Feedback Voltage Pin
VOUT
5
Output Voltage Pin
VIN
6
8
Input Voltage Pin
SGND
2
Signal Ground Pin
PGND
3
Power Ground Pin
VOUTS
7
Output Voltage Sense Pin
VOUTP
6
Output Voltage Power Pin
EP
9
Exposed Thermal Pad (EP); must be connected to VSS.


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