LY61256

Rev. 1.7

32K X 8 BIT HIGH SPEED CMOS SRAM

5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.

TEL: 886-3-6668838

FAX: 886-3-6668836

9

®

28-pin 300 mil SOJ Package Outline Dimension

1

28

14

15

A2

L

C

XX

X

Note : 1.S/E/D dimension is not including mold flash.

2.The end flash in package lengthwise is not more than 10 mils each side.

UNIT

SYM.

INCH(REF)

MM(BASE)

A

0.140(MAX)

3.556(MAX)

A1

0.025(MIN)

0.635(MIN)

A2

0.100±0.015

2.540±0.381

B

0.018±0.004

0.457±0.102

B1

0.028±0.004

0.711±0.102

c

0.010±0.004

0.254±0.102

D

0.710±0.020

18.03±0.508

E

0.337±0.010

8.560±0.254

E1

0.300±0.005

7.620±0.127

e

0.050±0.006

1.270±0.152

L

0.087±0.010

2.210±0.254

S

0.045(MAX)

1.143(MAX)

Y

0.004(MAX)

0.102(MAX)