Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance specifications.

Rework

• A device should not be reworked.

CMF-SDP SERIES, REV. C, 11/08

CMF-SDP Series - Telecom CPTC Resettable Fuses

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

Recommended Pad Layout

Recommended Pad Layout

Packaging options: TAPE & REEL: 350 pcs. per reel

Packaging options: TAPE & REEL: 400 pcs. per reel

MM

(INCHES)

DIMENSIONS =

8.75

(.344)

MAX.

MAX.

MAX.

7.2

(.283)

3.9

(.154)

0.5

(.020)

2 PLCS.

10.2

(402)

2.4

(.094)

CMF-SDP10A, 25A, 35A & 50A

5.0

(.197)

11.0

(.433)

MAX.

9.0

(.354)

MAX.

11.5

(.453)

MAX.

2.6

(.102)

CMF-SDP07, 10, 25, 35, 50 & 75

7.2

(.283)

MAX.

8.75

(.344)

MAX.

3.2

(.126)

2.0

(.079)

2.4

(.094)

6.3

(.248)

3.9

(.154)

8.2

(.323)

9.0

(.354)

10.0

(.394)

3.2

(.126)

2.0

(.079)

2.6

(.102)

7.6

(.299)

11.0

(.433)

5.0

(.197)