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MP2560 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP2560 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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MP2560 – 2.5A, 4MHz, 42V STEP-DOWN CONVERTER MP2560 Rev. 1.2 www.MonolithicPower.com 2 1/25/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2010 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Temperature MP2560DQ 3x3 QFN10 S8YW MP2560DN SOIC8E MP2560DN –40 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP2560DQ–Z). For RoHS Compliant Packaging, add suffix –LF (eg. MP2560DQ–LF–Z) ** For Tape & Reel, add suffix –Z (eg. MP2560DN–Z). For RoHS Compliant Packaging, add suffix –LF (eg. MP2560DN–LF–Z) PACKAGE REFERENCE TOP VIEW SW SW EN COMP FB 1 2 3 4 5 BST VIN VIN FREQ GND 10 9 8 7 6 EXPOSED PAD ON BACKSIDE CONNECT TO GND SW EN COMP FB BST VIN FREQ GND 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD CONNECT TO GND ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN).....................–0.3V to +45V Switch Voltage (VSW) .......................................... ............. –0.3V (-7V for < 10ns) to VIN + 0.3V BST to SW .....................................–0.3V to +6V All Other Pins.................................–0.3V to +6V Continuous Power Dissipation… (TA = +25°C) (2) 3x3 QFN10 ................................................ 2.5W SOIC8 ........................................................ 2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature.............. –65°C to +150 °C Recommended Operating Conditions (3) Supply Voltage VIN ...........................4.5V to 42V Output Voltage VOUT.........................0.8V to 39V Operating Temperature............. –40 °C to +85°C Thermal Resistance (4) θJA θJC 3x3 QFN10 ............................. 50 ...... 12... °C/W SOIC8 (Exposed Pad) ............ 50 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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