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LM25085MMX Datasheet(PDF) 4 Page - Texas Instruments |
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LM25085MMX Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page LM25085, LM25085-Q1 SNVS593H – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 24V, RT = 100kΩ. Symbol Parameter Conditions Min Typ Max Units RT Pin RTSD Shutdown Threshold RT Pin Voltage Rising 0.73 V RTHYS Shutdown Threshold Hysteresis 50 mV On-Time tON – 1 On-Time VIN = 4.5V, RT = 100kΩ 3.5 5 7.15 µs tON – 2 VIN = 24V, RT = 100kΩ 560 720 870 ns tON - 3 VIN = 42V, RT = 100kΩ 329 415 500 ns tON - 4 Minimum On-Time in Current Limit VIN = 24V, 25mV Overdrive at ISEN 55 140 235 ns (3) Off-Time tOFF(CL1) Off-Time (Current Limit) (3) VIN = 12V, VFB = 0V 5.35 7.9 10.84 µs tOFF(CL2) VIN = 12V, VFB = 1V 1.42 1.9 3.03 µs tOFF(CL3) VIN = 24V, VFB = 0V 8.9 13 17.7 µs tOFF(CL4) VIN = 24V, VFB = 1V 2.22 3.2 4.68 µs Regulation and Over-Voltage Comparators (FB Pin) VREF FB Regulation Threshold 1.225 1.25 1.275 V VOV FB Over-Voltage Threshold Measured With Respect to VREF 350 mV IFB FB Bias Current 10 nA Soft-Start Function tSS Soft-Start Time 1.4 2.5 4.3 ms Thermal Shutdown TSD Junction Shutdown Temperature Junction Temperature Rising 170 °C THYS Junction Shutdown Hysteresis 20 °C Thermal Resistance(4) θJA Junction to Ambient, 0 LFPM Air VSSOP-8 package 126 °C/W Flow (5) HVSSOP-PowerPAD-8 package 46 WSON-8 package 54 θJC Junction to Case, 0 LFPM Air Flow VSSOP-8 package 29 °C/W (5) HVSSOP-PowerPAD-8 package 5.5 WSON-8 package 9.1 (3) The tolerance of the minimum on-time (tON-4) and the current limit off-times (tOFF(CL1) through (tOFF(CL4)) track each other over process and temperature variations. A device which has an on-time at the high end of the range will have an off-time that is at the high end of its range. (4) For detailed information on soldering plastic VSSOP and WSON packages visit www.ti.com/packaging. (5) Tested on a 4 layer JEDEC board. Four vias provided under the exposed pad. See JEDEC standards JESD51-5 and JESD51-7. 4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: LM25085 LM25085-Q1 |
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