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MP2009EE-1.8 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP2009EE-1.8 Datasheet(HTML) 2 Page - Monolithic Power Systems |
2 / 14 page MP2009-ULTRA LOW NOISE, LOW DROPOUT,120mA LINEAR REGULATOR MP2009 Rev. 1.2 www.MonolithicPower.com 2 12/18/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package VOUT(V) Top Marking Free Air Temperature Range (TA) MP2009EE-1.5 1.5 MP2009EE-1.8 1.8 8B MP2009EE-2.5 2.5 AQ MP2009EE-2.6 2.6 MP2009EE-2.7 2.7 MP2009EE-2.8 2.8 MP2009EE-2.85 2.85 MP2009EE-3 3 MP2009EE-3.3 3.3 9U MP2009EE-4.0 4.0 CG MP2009EE-4.5 5-SC70 4.5 -20 °C to +85°C * Available options are identified by those with top marking. For other options, please contact factory to check availability. PACKAGE REFERENCE 1 2 3 5 4 IN GND EN OUT NC TOP VIEW ABSOLUTE MAXIMUM RATINGS (1) Supply Input Voltage ................................. 6.5V Power Dissipation, PD @ TA =25°C (2) 5-SC70 .................................................. 0.385W Operation Temperature Range ... -20°C to 85°C Storage Temperature Range ..... -65°C to 150°C Lead Temperature (Soldering, 10sec) .....300°C Recommended Operating Conditions (3) Supply Input Voltage.......................2.0V to 6.0V Enable Input Voltage .........................0V to 6.0V Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC 5-SC70....................................260.....130 °C/W Notes: 1) Exceeding these ratings may cause permanent damage to the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to- ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C(typ) and disengages at TJ=130°C (typ). 3) The device is not guaranteed to function outside its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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