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AD7809BST Datasheet(PDF) 6 Page - Analog Devices

Part # AD7809BST
Description  3.3 V to 5 V Quad/Octal 10-Bit DACs
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD7809BST Datasheet(HTML) 6 Page - Analog Devices

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AD7804/AD7805/AD7808/AD7809
REV. A
–6–
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
TQFP (S
U-44) Package, Power Dissipation . . . . . .
450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2The outputs may be shorted to voltages in this range provided the power dissipation
of the package is not exceeded.
3Transient currents of up to 100 mA will not cause SCR latch-up.
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
COMP to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
REF OUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to + AVDD
REF IN to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
VOUT to AGND
2
. . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies
3
. . . . . . . .
±10 mA
Operating Temperature Range
AD7804/AD7805 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
AD7808/AD7809 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ORDERING GUIDE
Supply
Temperature
Relative
Package
Model
Voltage
Range
Accuracy
Package Descriptions
Options
AD7804BN
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
16-Lead Plastic DIP
N-16
AD7804BR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
16-Lead Small Outline IC
R-16
AD7805BN
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Plastic DIP
N-28
AD7805BR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28 Lead Small Outline IC
R-28
AD7805BRS
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Shrink Small Outline Package
RS-28
AD7805CR
3.3 V to 5 V
–40
°C to +85°C
±3 LSB
28-Lead Small Outline IC
R-28
AD7808BN
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
24-Lead Plastic DIP
N-24
AD7808BR
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
24 Lead Small Outline IC
R-24
AD7809BST
3.3 V to 5 V
–40
°C to +85°C
±4 LSB
44-Lead Thin Plastic Quad Flatpack (TQFP)
S
U-44
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE


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