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AD7809BST Datasheet(PDF) 6 Page - Analog Devices |
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AD7809BST Datasheet(HTML) 6 Page - Analog Devices |
6 / 28 page AD7804/AD7805/AD7808/AD7809 REV. A –6– PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C TQFP (S U-44) Package, Power Dissipation . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2The outputs may be shorted to voltages in this range provided the power dissipation of the package is not exceeded. 3Transient currents of up to 100 mA will not cause SCR latch-up. ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V COMP to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V REF OUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to + AVDD REF IN to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V VOUT to AGND 2 . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V Input Current to Any Pin Except Supplies 3 . . . . . . . . ±10 mA Operating Temperature Range AD7804/AD7805 Commercial Plastic (B, C Versions) . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C AD7808/AD7809 Commercial Plastic (B, C Versions) . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ORDERING GUIDE Supply Temperature Relative Package Model Voltage Range Accuracy Package Descriptions Options AD7804BN 3.3 V to 5 V –40 °C to +85°C ±3 LSB 16-Lead Plastic DIP N-16 AD7804BR 3.3 V to 5 V –40 °C to +85°C ±3 LSB 16-Lead Small Outline IC R-16 AD7805BN 3.3 V to 5 V –40 °C to +85°C ±3 LSB 28-Lead Plastic DIP N-28 AD7805BR 3.3 V to 5 V –40 °C to +85°C ±3 LSB 28 Lead Small Outline IC R-28 AD7805BRS 3.3 V to 5 V –40 °C to +85°C ±3 LSB 28-Lead Shrink Small Outline Package RS-28 AD7805CR 3.3 V to 5 V –40 °C to +85°C ±3 LSB 28-Lead Small Outline IC R-28 AD7808BN 3.3 V to 5 V –40 °C to +85°C ±4 LSB 24-Lead Plastic DIP N-24 AD7808BR 3.3 V to 5 V –40 °C to +85°C ±4 LSB 24 Lead Small Outline IC R-24 AD7809BST 3.3 V to 5 V –40 °C to +85°C ±4 LSB 44-Lead Thin Plastic Quad Flatpack (TQFP) S U-44 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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