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AD5293BRUZ-100 Datasheet(PDF) 9 Page - Analog Devices |
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AD5293BRUZ-100 Datasheet(HTML) 9 Page - Analog Devices |
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9 / 24 page  AD5293 Rev. D | Page 9 of 24 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Parameter Rating VDD to GND −0.3 V to +35 V VSS to GND +0.3 V to −25 V VLOGIC to GND −0.3 V to +7 V VDD to VSS 35 V VA, VB, VW to GND VSS − 0.3 V, VDD + 0.3 V Digital Input and Output Voltage to GND −0.3 V to VLOGIC +0.3 V EXT_CAP Voltage to GND −0.3 V to +7 V IA, IB, IW Continuous RAB = 20 kΩ ±3 mA RAB = 50 kΩ, 100 kΩ ±2 mA Pulsed1 Frequency > 10 kHz MCC2/d3 Frequency ≤ 10 kHz MCC2/√d3 Operating Temperature Range −40°C to +105°C Maximum Junction Temperature (TJ max) 150°C Storage Temperature Range −65°C to +150°C Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (TJ max − TA)/θJA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 7. Thermal Resistance Package Type θJA θJC Unit 14-Lead TSSOP 931 20 °C/W 1 JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow). ESD CAUTION 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 Maximum continuous current. 3 Pulse duty factor. |
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