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Junction Temperature (°C)

Wirebond Voiding Fail Mode

SN65472-EP

www.ti.com

SLRS061 – SEPTEMBER 2013

(1)

See Datasheet for Absolute Maximum and minimum Recommended Operating Conditions.

(2)

Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect

life).

Figure 1. SN65472-EP Wirebond Life Derating Chart

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