1

2

3

4

5

6

7

16

15

14

13

12

11

10

OUTD

-IND

+IND

V

-

+INC

-INC

OUTC

OUTA

-INA

+INA

V+

+INB

-INB

OUTB

8

9

SHDNC/D

SHDNA/B

A

D

B

C

1

2

3

4

8

7

6

5

V+

OUT B

-

IN B

+IN B

OUT A

-

IN A

+IN A

V

-

A

B

1

2

3

4

5

10

9

8

7

6

V+

VOUTB

-

INB

+INB

SHDNB

VOUTA

-

INA

+INA

V

-

SHDNA

A

B

1

2

3

4

5

6

7

14

13

12

11

10

9

8

OUTD

-

IND

+IND

V

-

+INC

-

INC

OUTC

OUTA

-

INA

+INA

V+

+INB

-

INB

OUTB

A

D

B

C

1

2

3

6

5

4

V+

SHDN

-

IN

VOUT

V

-

+IN

OUTA

-INA

+INA

V-

1

2

3

4

V+

OUTB

-INB

+INB

8

7

6

5

Exposed

Thermal

DiePad

on

Underside

1

2

3

5

4

V+

-

IN

OUT

V

-

+IN

OPA322-Q1, OPA322S-Q1

OPA2322-Q1, OPA2322S-Q1

OPA4322-Q1, OPA4322S-Q1

SLOS856A – JUNE 2013 – REVISED JUNE 2013

www.ti.com

PIN CONFIGURATIONS

DBV PACKAGE

SOT23-5

DFN-8

(TOP VIEW)

(TOP VIEW)

DBV PACKAGE

SOT23-6

(TOP VIEW)

PW PACKAGE

TSSOP-14

(TOP VIEW)

DGS PACKAGE

MSOP-10

(TOP VIEW)

PW PACKAGE

TSSOP-16

(TOP VIEW)

D, DGK PACKAGES

SO-8, MSOP-8

(TOP VIEW)

(1)

Connect thermal pad to V–.

(2)

Pad size: 2 mm × 1.2 mm.

6

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Product Folder Links: OPA322-Q1 OPA322S-Q1 OPA2322-Q1 OPA2322S-Q1 OPA4322-Q1 OPA4322S-Q1