OPA322-Q1 datasheet(3/23 Pages) TI1

Part #	OPA322-Q1

Description	20-MHz, Low-Noise, 1.8-V, RRI/O, CMOS Operational Amplifier With Shutdown

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Manufacturer	TI1 [Texas Instruments]

Direct Link	http://www.ti.com

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OPA322-Q1, OPA322S-Q1

OPA2322-Q1, OPA2322S-Q1

OPA4322-Q1, OPA4322S-Q1

www.ti.com

SLOS856A – JUNE 2013 – REVISED JUNE 2013

THERMAL INFORMATION: OPA322-Q1

OPA322-Q1

OPA322S-Q1

THERMAL METRIC(1)

DBV

UNIT

5 PINS

6 PINS

θJA

Junction-to-ambient thermal resistance

219.3

177.5

°C/W

θJC(top)

Junction-to-case(top) thermal resistance

107.5

108.9

°C/W

θJB

Junction-to-board thermal resistance

57.5

27.4

°C/W

ψJT

Junction-to-top characterization parameter

7.4

13.3

°C/W

ψJB

Junction-to-board characterization parameter

56.9

26.9

°C/W

θJC(bottom)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Spacer

THERMAL INFORMATION: OPA2322-Q1

OPA2322-Q1

OPA2322S-Q1

THERMAL METRIC(1)

D

DRG

DGK

DGS

UNIT

8 PINS

10 PINS

θJA

Junction-to-ambient thermal resistance

122.6

50.6

174.8

171.5

°C/W

θJC(top)

Junction-to-case(top) thermal resistance

67.1

54.9

43.9

43.0

°C/W

θJB

Junction-to-board thermal resistance

64.0

25.2

95.0

91.4

°C/W

ψJT

Junction-to-top characterization parameter

13.2

0.6

2.0

1.9

°C/W

ψJB

Junction-to-board characterization parameter

63.4

25.3

93.5

89.9

°C/W

θJC(bottom)

Junction-to-case(bottom) thermal resistance

N/A

5.7

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Spacer

THERMAL INFORMATION: OPA4322-Q1

OPA4322-Q1

OPA4322S-Q1

THERMAL METRIC(1)

PW

UNIT

14 PINS

16 PINS

θJA

Junction-to-ambient thermal resistance

109.8

105.9

°C/W

θJC(top)

Junction-to-case(top) thermal resistance

34.9

28.1

°C/W

θJB

Junction-to-board thermal resistance

52.5

51.1

°C/W

ψJT

Junction-to-top characterization parameter

2.2

0.8

°C/W

ψJB

Junction-to-board characterization parameter

51.8

50.4

°C/W

θJC(bottom)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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Product Folder Links: OPA322-Q1 OPA322S-Q1 OPA2322-Q1 OPA2322S-Q1 OPA4322-Q1 OPA4322S-Q1

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