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DRV8860 Datasheet(PDF) 4 Page - Texas Instruments |
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DRV8860 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page DRV8860 SLRS065A – SEPTEMBER 2013 – REVISED NOVEMBER 2013 www.ti.com Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) DRV8860 UNIT MIN MAX Power supply voltage range (VM) –0.3 40 V Digital input pin current range (ENABLE, LATCH, CLK, DIN) 0 20 mA Digital output pin voltage range (DOUT, nFAULT) –0.5 7 V Digital output pin current (DOUT, nFAULT) –0.5 7 V Output voltage range (OUTx) –0.3 40 V Output current range (OUTx) Internally limited A Operating virtual junction temperature range, TJ –40 150 °C Storage temperature range, Tstg –60 150 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) Power dissipation and thermal limits must be observed Thermal Information (1) over operating free-air temperature range (unless otherwise noted) DRV8860 THERMAL METRIC UNITS PW (16 PINS) ΘJA Junction-to-ambient thermal resistance (2) 103 ΘJC(TOP) Junction-to-case (top) thermal resistance(3) 37.9 ΘJB Junction-to-board thermal resistance(4) 48 °C/W ΨJT Junction-to-top characterization parameter(5) 3 ΨJB Junction-to-board characterization parameter(6) 47.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard 30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ΨJT, estimates the junction temperature of the device in a real system and is extracted from the simulation data for obtaining ΘJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ΨJB, estimates the junction temperature of the device in a real system and is extracted from the simulation data for obtaining ΘJA, using a procedure described in JESD51-2a (sections 6 and 7). Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VM Motor power supply voltage range 8.2 38 V IOUT Low-side driver current capability 560 mA TA Operating ambient temperature range –40 85 °C 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: DRV8860 |
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