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DRV8332HDDV Datasheet(PDF) 3 Page - Texas Instruments |
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DRV8332HDDV Datasheet(HTML) 3 Page - Texas Instruments |
3 / 25 page DRV8332-HT www.ti.com SLES274B – AUGUST 2013 – REVISED JANUARY 2014 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING –55°C to 175°C DDV DRV8332HDDV DRV8332H (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted (1) VALUE VDD to GND –0.3 V to 13.2 V GVDD_X to GND –0.3 V to 13.2 V PVDD_X to GND_X (2) –0.3 V to 70 V OUT_X to GND_X (2) –0.3 V to 70 V BST_X to GND_X (2) –0.3 V to 80 V Maximum bootstrap in rush current, IBST_In 0.4 A Transient peak output current (per pin), pulse width limited by internal over-current protection circuit. 16 A Transient peak output current for latch shut down (per pin) 20 A VREG to AGND –0.3 V to 4.2 V GND_X to GND –0.3 V to 0.3 V GND to AGND –0.3 V to 0.3 V PWM_X, RESET_X to GND –0.3 V to 4.2 V OC_ADJ, M1, M2, M3 to AGND –0.3 V to 4.2 V FAULT, OTW to GND –0.3 V to 7 V Maximum continuous sink current (FAULT, OTW) 9 mA Maximum operating junction temperature range, TJ -55°C to 185°C Storage temperature, TSTG –55°C to 175°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These voltages represent the dc voltage + peak ac waveform measured at the terminal of the device in all conditions. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT PVDD_X Half bridge X (A, B, or C) DC supply voltage 0 50 52.5 V GVDD_X Supply for logic regulators and gate-drive circuitry 10.8 12 13.2 V VDD Digital regulator supply voltage 10.8 12 13.2 V IO_PULSE Pulsed peak current per output pin (could be limited by thermal) 7 A IO Continuous current per output pin (DRV8332) 5 A FSW PWM switching frequency 380 kHz ROCP_CBC OC programming resistor range in cycle-by-cycle current limit modes 30 200 k Ω CBST Bootstrap capacitor range 33 220 nF TON_MIN Minimum PWM pulse duration, low side 50 ns TJ Operating junction temperature -55 175 °C Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: DRV8332-HT |
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