PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Op Temp (°C)

Top-Side Markings

(4)

Samples

TPA2005D1DGN

ACTIVE

MSOP-

PowerPAD

DGN

8

80

Green (RoHS

& no Sb/Br)

CU NIPDAUAG

Level-1-260C-UNLIM

-40 to 85

BAL

TPA2005D1DGNG4

ACTIVE

MSOP-

PowerPAD

DGN

8

80

Green (RoHS

& no Sb/Br)

CU NIPDAUAG

Level-1-260C-UNLIM

-40 to 85

BAL

TPA2005D1DGNR

ACTIVE

MSOP-

PowerPAD

DGN

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAUAG

Level-1-260C-UNLIM

-40 to 85

BAL

TPA2005D1DGNRG4

ACTIVE

MSOP-

PowerPAD

DGN

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAUAG

Level-1-260C-UNLIM

-40 to 85

BAL

TPA2005D1DRBR

ACTIVE

SON

DRB

8

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BIQ

TPA2005D1DRBRG4

ACTIVE

SON

DRB

8

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BIQ

TPA2005D1GQYR

ACTIVE

BGA

MICROSTAR

JUNIOR

GQY

15

2500

TBD

SNPB

Level-2-235C-1 YEAR

-40 to 85

PB051

TPA2005D1ZQYR

ACTIVE

BGA

MICROSTAR

JUNIOR

ZQY

15

2500

Green (RoHS

& no Sb/Br)

SNAGCU

Level-2-260C-1 YEAR

-40 to 85

AAFI

TPA2005D1ZQYRG1

ACTIVE

BGA

MICROSTAR

JUNIOR

ZQY

15

2500

Green (RoHS

& no Sb/Br)

SNAGCU

Level-2-260C-1 YEAR

-40 to 85

AAFI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.