BOARD LAYOUT

Component Location

Trace Width

MicroStar Junior™ BGA Layout

0,28

mm

0,38

mm

0,25

mm

SD

NC

IN+

IN−

GND

GND

GND

GND

GND

GND

GND

VDD

VDD

Vo+

Vo−

Solder Mask

Paste Mask

Copper Trace

TPA2005D1

Place all the external components close to the TPA2005D1. The input resistors need to be close to the

TPA2005D1 input pins so noise does not couple on the high impedance nodes between the input resistors and

for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the

capacitor can cause a loss in efficiency.

0,7 mm. If these traces are too thin, the TPA2005D1's performance and output power will decrease. The input

traces do not need to be wide, but do need to run side-by-side to enable common-mode noise cancellation.

Use the following MicroStar Junior BGA ball diameters:

• 0,25 mm diameter solder mask

• 0,28 mm diameter solder paste mask/stencil

• 0,38 mm diameter copper trace

Figure 38 shows how to lay out a board for the TPA2005D1 MicroStar Junior BGA.

Figure 38. TPA2005D1 MicroStar Junior BGA Board Layout (Top View)

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Product Folder Link(s): TPA2005D1