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CLT-117-02-L-D-BE Datasheet(PDF) 1 Page - Samtec, Inc |
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CLT-117-02-L-D-BE Datasheet(HTML) 1 Page - Samtec, Inc |
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1 / 1 page CLT–130–02–L–D Tiger ClawTM contacts (2,00mm) .0787" pitch Available with optional Pick & Place Pads Available with optional alignment pins Suitable for pass-through applications Low profile (2,21mm) .087" CLT–108–02–F–D–A–K CLT–116–02–F–D–A WWW.SAMTEC.COM 2mm LOW PROFILE CLT SERIES PLATING OPTION NO. PINS PER ROW 1 CLT D 02 thru 50 OTHER OPTIONS All options require Style –02 –BE = Bottom Entry (Required for bottom entry applications) –A = Alignment Pin (3 positions minimum) Metal or plastic at Samtec’s discretion –K = (5,00mm) .197" DIA Polyimide Film Pick & Place Pad (04 thru 50 only) –P = Pick & Place Pad (4 positions minimum) (Not always necessary for auto placement.) –TR = Tape & Reel Packaging (36 positions max) Mates with: TMM, TMMH, MTMM, MMT, TW For complete specifications and recommended PCB layouts see www.samtec.com?CLT Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Sn or Au over 50µ" (1,27µm) Ni Current Rating: 2A @ 80°C ambient Operating Temp Range: -55°C to +125°C Contact Resistance: 10 m Ω max Insertion Depth: Top Entry= (1,40mm) .055" minimum Bottom Entry= (2,57mm) .101" minimum (add board thickness for correct post OAL) Insertion Force: (Single contact only) 1.8oz (0,50N) avg. Withdrawal Force: (Single contact only) .6oz (0,17N) avg. Max Cycles: 100 with 10µ" (0,25µm) Au RoHS Compliant: Yes Processing: Max Processing Temp: 230°C for 60 seconds, or 260°C for 20 seconds 3x Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (02-25) (0,15mm) .006" max (26-34) (0,20mm) .008" max (35-50) Note: Some lengths, styles and options are non-standard, non-returnable. TAPE & REEL AVAILABILITY Call Samtec for specifications and ordering information. No tooling charges. 125 piece minimum order. Order any quantity above minimum. In-house design, manufacture. Quick turn-around. F-208 LEAD STYLE –01 = Through- hole –02 = Surface Mount SPECIFICATIONS –G = 10µ" (0,25µm) Gold –L = 10µ" (0,25µm) Gold on contact, Matte Tin on tail –F = Gold flash on contact, Matte Tin on tail *Processing Note: For Pass-through application drill PCB on (2,22) .0874 row spacing & (1,22) .048 DIA holes (4,00) .157 No. of positions x (2,00) .0787 01 02 (2,00) .0787 (2,13) .084 (0,51) .020 (0,51) .020 (0,64) .025 DIA (0,81) .032 (5,08) .200 x (5,71) .225 (5,16) .203 (2,26) .089 (3,02) * .119 (2,16) .085 –01 –A –P –02 |
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