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TLP620 Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part No. TLP620
Description  Programmable Controllers AC / DC−Input Module Telecommunication
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Maker  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP620 Datasheet(HTML) 2 Page - Toshiba Semiconductor

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TLP620,TLP620−2,TLP620−4
2007-10-01
2
Made In Japan
Made In Thailand
UL recognized
E67349
*1
E152349
*1
BSI approved
7426, 7427
*2
7426, 7427
*2
*1 UL1577
*2 BS EN60065: 2002, BS EN60950-1: 2002
• Isolation voltage: 5000Vrms (min.)
• Option (D4) type
VDE approved: DIN EN 60747-5-2, certificate no.40009302
Maximum operating insulation voltage: 890VPK
Highest permissible over voltage: 8000VPK
(Note) When an EN 60747-5-2 approved type is needed,
please designate the “Option(D4)”.
• Creepage distance: 6.4mm (min.)
Clearance: 6.4mm (min.)
Insulation thickness: 0.4mm (min.)
Absolute Maximum Ratings (Ta = 25°C)
Rating
Characteristic
Symbol
TLP620
TLP620
−2
TLP620
−4
Unit
Forward current
IF (RMS)
60
50
mA
Forward current derating
ΔIF / °C
−0.7 (Ta ≥ 39°C)
−0.5 (Ta ≥ 25°C)
mA / °C
Pulse forward current
IFP
1 (100μs pulse, 100pps)
A
Power dissipation (1 circuit)
PD
100
70
mW
Power dissipation derating
ΔPD / °C
−1.0
−0.7
mW / °C
Junction temperature
Tj
125
°C
Collector
−emitter voltage
VCEO
55
V
Emitter
−collector voltage
VECO
7
V
Collector current
IC
50
mA
Collector power dissipation
(1 circuit)
PC
150
100
mW
Collector power dissipation
derating (1 circuit) (Ta ≥ 25°C)
ΔPC / °C
−1.5
−1.0
mW / °C
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−55~100
°C
Lead soldering temperature
Tsold
260 (10s)
°C
Total package power dissipation
PT
250
150
mW
Total package power dissipation
derating (Ta ≥ 25°C, 1 circuit)
ΔPT / °C
−2.5
−1.5
mW / °C
Isolation voltage
BVS
5000 (AC, 1 min., RH ≤ 60%)
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).


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