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TCK107G Datasheet(PDF) 6 Page - Toshiba Semiconductor |
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TCK107G Datasheet(HTML) 6 Page - Toshiba Semiconductor |
6 / 11 page TCK106G/TCK107G/TCK108G 2012-12-11 6 2. Power Dissipation Power dissipation is measured on the board condition shown below. [The Board Condition] Board material: Glass epoxy (FR4) Board dimension: 40mm x 40mm (both sides of board),t=1.8mm Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5mm x 28 Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for allowable power dissipation during operation. 0 200 400 600 800 1000 -40 0 40 80 120 Ambient Temperature Ta (℃) PD -Ta |
Similar Part No. - TCK107G |
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Similar Description - TCK107G |
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