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IXDN502D1 Datasheet(PDF) 11 Page - IXYS Corporation |
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IXDN502D1 Datasheet(HTML) 11 Page - IXYS Corporation |
11 / 12 page 11 IXDF502 / IXDI502 / IXDN502 When designing a circuit to drive a high speed MOSFET utilizing the IXD_502, it is very important to observe certain design criteria in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXD_502 to charge a 1500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I = C ∆V/∆t, where ∆V=25V C=1500pF & ∆t=25ns, we can determine that to charge 1500pF to 25 volts in 25ns will take a constant current of 1.5A. (In reality, the charging current won’t be constant, and will peak somewhere around 2A). SUPPLY BYPASSING In order for our design to turn the load on properly, the IXD_502 must be able to draw this 1.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is an order of magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected and should have low inductance, low resistance and high-pulse current- service ratings). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXD_502 to an absolute minimum. Supply Bypassing, Grounding Practices And Output Lead inductance GROUNDING In order for the design to turn the load off properly, the IXD_502 must be able to drain this 1.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXD_502 and its load. Path #2 is between the IXD_502 and its power supply. Path #3 is between the IXD_502 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXD_502. OUTPUT LEAD INDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and its load as short and wide as possible. If the driver must be placed farther than 0.2” (5mm) from the load, then the output leads should be treated as transmission lines. In this case, a twisted-pair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin of the driver, and connected directly to the ground terminal of the load. |
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