MAX15023ETG-T datasheet(2/28 Pages) MAXIM

Part #	MAX15023ETG-T

Description	Wide 4.5V to 28V Input, Dual-Output Synchronous Buck Controller

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Manufacturer	MAXIM [Maxim Integrated Products]

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MAX15023

Wide 4.5V to 28V Input, Dual-Output

Synchronous Buck Controller

2

Maxim Integrated

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VIN = 12V, RT = 33kΩ, CVCC = 4.7µF, CIN = 1µF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)

(Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150°C),

and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection

included in this IC.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial.

IN to SGND.............................................................-0.3V to +30V

BST_ to VCC............................................................-0.3V to +30V

LX_ to SGND .............................................................-1V to +30V

EN_ to SGND............................................................-0.3V to +6V

PGOOD_ to SGND .................................................-0.3V to +30V

BST_ to LX_ ..............................................................-0.3V to +6V

DH_ to LX_ ..........................................….-0.3V to (VBST_ + 0.3V)

DL_ to PGND_ ............................................-0.3V to (VCC + 0.3V)

SGND to PGND_ .................................................. -0.3V to +0.3V

VCC to SGND................-0.3V to the lower of +6V or (VIN + 0.3V)

All Other Pins to SGND...............................-0.3V to (VCC + 0.3V)

VCC Short Circuit to SGND.........................................Continuous

VCC Input Current (IN = VCC, internal LDO not used) ......600mA

PGOOD_ Sink Current ........................................................20mA

Continuous Power Dissipation (TA = +70°C)(Note 1)

24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)......2222.2mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-60°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

5.5

28

Input Voltage Range

VIN

VIN = VCC

4.5

5.5

V

Quiescent Supply Current

IIN

VFB1 = VFB2 = 0.9V, no switching

4.5

6

mA

Standby Supply Current

IIN_SBY

VEN1 = VEN2 = VSGND

0.21

0.35

mA

VCC REGULATOR

6V < VIN < 28V, ILOAD = 5mA

Output Voltage

VCC

VIN = 6V, 1mA < ILOAD < 100mA

5.00

5.2

5.50

V

VCC Regulator Dropout

ILOAD = 100mA

0.07

V

VCC Short-Circuit Output Current

VIN = 5V

150

250

mA

VCC Undervoltage Lockout

VCC_UVLO VCC falling

3.6

3.8

4

V

VCC Undervoltage Lockout

Hysteresis

430

mV

ERROR AMPLIFIER (FB_, COMP_)

FB_ Input Voltage Set-Point

VFB_

594

600

606

mV

FB_ Input Bias Current

IFB_

VFB_ = 0.6V

-250

+250

nA

PACKAGE THERMAL CHARACTERISTICS (Note 2)

24 TQFN-EP

Junction-to-Ambient Thermal Resistance (

θJA)...............+36°C/W

Junction-to-Case Thermal Resistance (

θJC)......................+8°C/W

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