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RT0402BKB0710RL Datasheet(PDF) 8 Page - YAGEO Corporation |
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RT0402BKB0710RL Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 10 page Chip Resistor Surface Mount www.yageo.com Oct 21, 2009 V.4 Product specification 8 10 SERIES RT 0402 to 2512 (RoHS Compliant) TEST TEST METHOD PROCEDURE REQUIREMENTS Short Time Overload IEC60115-1 4.13 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 sec at room temperature ±(0.5%+0.05 Ω) No visible damage Board Flex/ Bending IEC 60068-2-21 Chips mounted on a 90mm glass epoxy resin PCB (FR4) Bending: see table 6 for each size Bending time: 60±5 seconds ±(0.25%+0.05 Ω) No visible damage Low Temperature Operation IEC 60068-2-1 The resistor shall be subjected to a DC rated voltage for 1.5 h-on, 0.5 h-off, at -55±3 °C This constitutes shall be repeated for 96 hours However the applied voltage shall not exceed the maximum operating voltage ±(0.5%+0.05 Ω) No visible damage Insulation Resistance IEC 60115-1 4.6 Rated continuous overload voltage (RCOV) for 1 minute Details see below table 5 ≥10 GΩ Dielectric Withstand Voltage IEC 60115-1 4.7 Maximum voltage (Vrms) applied for 1 minute Details see below table 5 No breakdown or flashover Solderability - Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155°C dry heat 2nd step: leadfree solder bath at 245±3°C Dipping time: 3±0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60068-2-58 Condition B, no pre-heat of samples. Leadfree solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(0.5%+0.05 Ω) No visible damage |
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