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RC5025 Datasheet(PDF) 7 Page - Samsung semiconductor |
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RC5025 Datasheet(HTML) 7 Page - Samsung semiconductor |
7 / 40 page 6 7 •Pre-heating and cooling In the reflow soldering method, a full pre-heating at the proper temperature is necessary to dry and activate solder paste. Tomb-stoning can be reduced by preheating at 150~180℃ for more than 1 minute. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature difference within 150℃. •Standard Reflow Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the right graph. This prevents the terminations from leaching and characteristics from deteriorating. When soldering is repeated, the allowed time is the accumulated time. •Standard solder amount When a PCB is warped, mechanical stress applied to the chip should be reduced, and for doing so, care should be taken not to use excessive amount of solder on the PCB. In case of the reflow method, the thickness of the coated solder paste is controlled to prevent excessive solder. The thickness of solder paste should be 100~300㎛. When using a soldering iron or any other soldering operation, the permissible temperature and time should not be exceeded that in the reflow soldering. In other to prevent the external terminations from leaching and characteristics from deteriorating, the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering iron and correcting with a soldering iron can be performed right the following conditions. Temperature at tip Soldering iron output End of soldering iron Note 350 ℃ Max. 20-Watt Max. Ø3mm Max. Do not directly touch the chip by the tip of the iron. Item Condition Ceramic Substrate Inner Electrode Resistor Glass Coat Protective Coat Terminal Coat Ni Plate Sn Plate Al2O3 Ag / Cu Ag-Pd / Cu-Ni Bi2O3, SiO2 Polymer / Glass Ni-Cr Alloy Ni Sn Name No. Main Substance < Reflow Soldering> •Tombstoning and Prevention When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon. - Preventing tombstoning Keep land size as small as possible. Keep the pre-heating conditions properly ( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.) Keep the solder paste quantity not too much and uniform for every lands. Keep the position of chips properly. At around the soldering temperature, keep minimize the difference of the temperature between the electrodes of a chip. Reflow Soldering Iron Soldering General Structure of the Chip Resistor Pre-heating 217 ℃ Soldering Temp.( ℃) 200 ℃ 150 ℃ Gradual Cooling in the air 245 ±10℃ 10 sec. max. Time(sec.) The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. General Structure Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUK Series) Ultra Low Ohms (RUW Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value |
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Similar Description - RC5025 |
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