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RC5025 Datasheet(PDF) 7 Page - Samsung semiconductor

Part # RC5025
Description  THICK-FILM CHIP RESISTOR
Download  40 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC5025 Datasheet(HTML) 7 Page - Samsung semiconductor

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•Pre-heating and cooling
In the reflow soldering method, a full pre-heating at the proper
temperature is necessary to dry and activate solder paste.
Tomb-stoning can be reduced by preheating at 150~180℃ for
more than 1 minute. Also when cooling is done by dipping into
solvent, care should be taken to keep the temperature difference
within 150℃.
•Standard Reflow Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. This prevents the terminations from leaching
and characteristics from deteriorating. When soldering is
repeated, the allowed time is the accumulated time.
•Standard solder amount
When a PCB is warped, mechanical stress applied to the chip should be reduced, and for doing so, care should be taken not to
use excessive amount of solder on the PCB. In case of the reflow method, the thickness of the coated solder paste is controlled to
prevent excessive solder. The thickness of solder paste should be 100~300㎛.
When using a soldering iron or any other soldering operation, the permissible temperature and time should not be exceeded
that in the reflow soldering. In other to prevent the external terminations from leaching and characteristics from deteriorating,
the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering
iron and correcting with a soldering iron can be performed right the following conditions.
Temperature at tip
Soldering iron output
End of soldering iron
Note
350
℃ Max.
20-Watt Max.
Ø3mm Max.
Do not directly touch the chip by the tip of the iron.
Item
Condition
Ceramic Substrate
Inner Electrode
Resistor
Glass Coat
Protective Coat
Terminal Coat
Ni Plate
Sn Plate
Al2O3
Ag / Cu
Ag-Pd / Cu-Ni
Bi2O3, SiO2
Polymer / Glass
Ni-Cr Alloy
Ni
Sn
Name
No.
Main Substance
< Reflow Soldering>
•Tombstoning and Prevention
When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break
away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon.
- Preventing tombstoning
Keep land size as small as possible.
Keep the pre-heating conditions properly
( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.)
Keep the solder paste quantity not too much and uniform for every lands.
Keep the position of chips properly.
At around the soldering temperature, keep minimize the difference of the temperature between the electrodes of a chip.
Reflow Soldering
Iron Soldering
General Structure of the Chip Resistor
Pre-heating
217
Soldering
Temp.(
℃)
200
150
Gradual Cooling
in the air
245
±10℃
10 sec. max.
Time(sec.)
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
General Structure
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value


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