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RL1220-4S-R100J Datasheet(PDF) 5 Page - DAESAN ELECTRONIC CORP. |
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RL1220-4S-R100J Datasheet(HTML) 5 Page - DAESAN ELECTRONIC CORP. |
5 / 8 page PAGE 5 OF 8 TITLE : 台達電子工業股份有限公司 台達電子工業股份有限公司 台達電子工業股份有限公司 台達電子工業股份有限公司 Delta Electronics, Inc. DOCUMENT NO. SR340000NH PAGE REV. A0 THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION UNLESS OTHERWISE SPECIFIED TOLERANCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± SCALE : UNIT : The Engineering Spec. For 1/2W 1220 Low Resistance Chip Resistor Unit : mm 100 a f b 4.5 Land Solder resist Mounting Method (1) Mounting method according to solder bath method Epoxy based adhesive agent shall be applied in the middle of two lands of the test board. The specimen shall be mounted in such a way that the electrode of specimen will be evenly placed in the land area and then adhesive agent shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260 ± 5℃ for 3 to 5 seconds (2) Mounting method according to refolw soldering method Solder paste with approximate 200 µm thickness shall be applied to the land of test board. The specimen shall be mounted in such way that the electrodes of specimen will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 240 ± 5℃(peak temperature) for 5 to 10 seconds in an upper-heater oven. Test Board Material : Glass Fabric Epoxy Resin (Refer to JIS C 6484) Board thickness : 1.6mm Copper foil thickness : 0.035mm (1) Test board A (For substrate bending test) a b c f 1.2 4.0 1.65 (3.0) |
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