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4610H-803-101103 Datasheet(PDF) 60 Page - Bourns Electronic Solutions |
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4610H-803-101103 Datasheet(HTML) 60 Page - Bourns Electronic Solutions |
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60 / 62 page  Specifications are subject to change without notice. 336 1 Solder Paste Printing Reflow; Convection, IR and Vapor Phase This application note is designed to provide step-by-step processing recommendations. It covers the popular soldering process currently in use and provides recommendations and cautions for each step. Since many variations of time, temperature, processes, cleaning agents and board types in use, you will want to verify your own system. Bourns does not recommend the backside mounting of passive components. The process steps, recommendations and cautions are based on Bourns surveys of users, equip- ment manufacturers and materials suppliers. No warranty expressed or implied is made in regards to the following recommendations. GENERAL Use the optimum solder paste for the pattern, printing process, and sol- der joint quality. RECOMMENDED Typical solder paste alloy is 63Sn/37Pb. RMA,No-Clean or Halide Free Water Soluble fluxes should be used. CAUTION Since solder paste usually contains a high percentage of activators, you must ensure adequate cleaning to remove all residues. Consult your solder paste supplier for cleaning meth- ods. When cleaning addi- tives are needed, only those that are Halide Free should be used. 2 Adhesive Application GENERAL The adhesive must hold the unit in correct orientation upon placement and main- tain the correct position during any physical han- dling before the final sol- dering process. RECOMMENDED To assure positional stabili- ty, place a single dot of epoxy under the unit. CAUTION Use sufficient adhesive to assure stability through the cure process. Avoid overflow of epoxy onto solder pads and termi- nal areas. Excessive curing before placement may not allow full seating of the part causing incomplete solder connections. 3 Network Placement GENERAL Use pick-and-place equip- ment with a vacuum nozzle ID that allows adequate suction to pick the unit out of the pocket cavity. RECOMMENDED Ensure nozzle inside diam- eter and vacuum levels are adequate to maintain suc- tion and part alignment. CAUTION Ensure parts are placed so that all leads are centered on the solder pads. Align the leads with the sol- der belt direction of travel to avoid the part body cre- ating a thermal shadowing effect. Excessive placement force to the part should be avoid- ed to minimize the risk of package damage. 5 Flux Application Flow (Wave) GENERAL Use the correct flux to remove surface oxides, prevent re-oxidation and promote wetting. RECOMMENDED RMA (Rosin Mildly Activated) flux or Halide Free Water Soluble flux is recommended. CAUTION Avoid fluxes with Halide activators. 4 Adhesive Cure GENERAL Heat/time cure should be accomplished using either an infrared radiation or a convection oven. RECOMMENDED Cure using the temperature profile specified by the adhe- sive manufacturer. CAUTION Use sufficient cure time to ensure complete adhesive transition from fluid to solid. Care should be taken to assure the placed units are not exposed to temperatures in excess of the manufactur- er's maximum. Do not exceed the maximum temperature rating of the component. Epoxy Soldering And Cleaning Processes |
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