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4610M-801-101103 Datasheet(PDF) 32 Page - Bourns Electronic Solutions |
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4610M-801-101103 Datasheet(HTML) 32 Page - Bourns Electronic Solutions |
32 / 62 page Specifications are subject to change without notice. 308 Standard Resistance Values And Codes Values not appearing in above tables are available to optimize system performance. Contact Bourns Networks to inquire. Resistance Resistance Resistance Resistance (Ohms) Code (Ohms) Code 22 220 5,600 562 27 270 6,800 682 33 330 8,200 822 39 390 10,000 103 47 470 12,000 123 56 560 15,000 153 68 680 18,000 183 82 820 20,000 203 100 101 22,000 223 120 121 27,000 273 150 151 33,000 333 180 181 39,000 393 220 221 47,000 473 270 271 56,000 563 330 331 68,000 683 390 391 82,000 823 470 471 100,000 104 560 561 120,000 124 680 681 150,000 154 820 821 180,000 184 1,000 102 220,000 224 1,200 122 270,000 274 1,500 152 330,000 334 1,800 182 390,000 394 2,000 202 470,000 474 2,200 222 2,700 272 3,300 332 3,900 392 Standard Capacitance Values And Codes Capacitance Capacitance Capacitance Capacitance Code Code 39pF 390 1000pF 102 47 470 1200 122 56 560 1500 152 68 680 1800 182 82 820 2200 222 100 101 2700 272 120 121 3300 332 150 151 3900 392 180 181 4700 472 220 221 5600 562 270 271 6800 682 330 331 8200 822 390 391 .010µF 103 470 471 .012 123 560 561 .015 153 680 681 .018 183 820 821 .022 223 .027 273 .033 333 .039 393 .047 473 How To Order RC Terminator Networks 46 08 H - 701 - RC/CC Model Resistance/ (46 = Conformal SIP) Capacitance Code • First two digits are significant Number of Pins • Third digit • 4 to 16 represents the number of zeros to follow. Physical Configuration (H = High Profile) Electrical Configuration • 701 = Single Termination • 702 = Double Termination 700 Series - Resistor Networks RC Terminator Networks Additional Features s Prevent bus lines and control signals from floating to undefined logic levels. s Optimize signal transmission in high performance systems through proper termination. s Eliminate overshoot and ringing, increase noise immunity, minimize signal distor- tion, and lower EMI/RFI radiation. s Minimize space and routing problems, and reduce manufacturing cost per installed resistive function. s Increase board yields and reliability by reducing component count. |
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