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4610H-802-500103 Datasheet(PDF) 61 Page - Bourns Electronic Solutions |
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4610H-802-500103 Datasheet(HTML) 61 Page - Bourns Electronic Solutions |
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61 / 62 page  Specifications are subject to change without notice. 337 These are the common methods, materials and maximum temperature/ time parameters for soldering and cleaning processes: Soldering/Cleaning Methods REFLOW FLOW Hot Air, Infrared Vapor Phase Wave Wave Process Step (Solvent) (Solvent) (Solvent) (Aqueous) Material 1. Solder Paste Printing X X RMA 2. Adhesive Application X X Epoxy 3. Switch Placement X X X X 4. Adhesive Cure X X 5. Flux Application X Rosin 5. Flux Application X Organic Acid 6. Solder (Reflow) X X 63/37 Sn/Pb 7. Solder (Flow) X X 63/37 Sn/Pb 8. Wash (Solvent) X X X ODS Free 9. Wash (Aqueous) X DI H2O; Detergent High Pressure Fluids X Ultrasonics X X X Max. Temp.(°C)/Time (Seconds) 240/30 215/180 260/5 260/5 6 Solder Reflow; Convection, IR and Vapor Phase GENERAL Preheat sufficiently using both time and temp. to bring the flux to activa- tion and minimize thermal shock. Consult your solder paste supplier for the recommended profile. RECOMMENDED Typical IR/Convection profile. Use convection or Vapor Phase when possible and minimize the time above reflow temperature. CAUTION Do not exceed time and temperature reflow profile of 240°C for 30 sec. for Hot Air/IR reflow and 215°C for 3 minutes for vapor phase reflow. Minimize thermal shock by limiting temperature ramps to 3°C/sec. and by stabilizing board and component tem- perature during preheating. 7 Solder Flow (Wave) GENERAL For maximum component reliability and performance, minimize the time of temp. exposure above 200°C. RECOMMENDED Typical alloy is Sn63/Pb37. A typical wave solder zone profile is 245˚C for 5 sec. CAUTION Always preheat before the soldier wave using the temperature for flux activation recommended by the man- ufacturer. Do not exceed 240˚C peak tempera- ture for dual wave solder process with a flow zone totaling 5 seconds. Minimize thermal shock by limiting temperature ramps to 3˚C/sec. and by stabilizing board and component temperature during preheating. 8 Wash Solvent GENERAL Use solvent cleaning primarily for nonpolar contaminants such as rosin based flux residues. RECOMMENDED Use any suitable washing sol- vents that meet ODS require- ments. CAUTION Limit excessive direct spray pressure to 60 psi. Allow the assembly to suffi- ciently cool prior to the wash- ing operation for minimized thermal stress. 9 Wash Aqueous GENERAL Use aqueous cleaning primarily for polar contaminants such as organic flux residues. RECOMMENDED Use De-ionized or Reverse Osmosis water with multistage rinsing. Post bake at 100˚C for 30 minutes to remove any resid- ual moisture. CAUTION Limit excessive direct spray pressure to 60 psi. Allow the assembly to sufficient- ly cool prior to the washing oper- ation for minimized thermal stress. Board Rework Technique GENERAL Excessive and/or repeated high temperature exposure may affect the component perfor- mance and reliability. RECOMMENDED Hot air reflow technique is pre- ferred. Use No Clean or Rosin based fluxes only, OA fluxes are recommended. CAUTION Avoid the use of wave soldering or soldering irons as a rework technique. Avoid repeated and excessive temperature exposure. PRE-HEATING (in air) SOLDERING GRADUAL COOLING (in air) 200°C 100°C 0°C ONE MINUTE MIN. 20 SECOND MAX. 230°C PRE-HEATING (in air) SOLDERING GRADUAL COOLING (in air) 200°C 100°C 0°C ONE MINUTE MIN. 5 SECOND MAX. 245°C |
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