PACKAGE OPTION ADDENDUM

www.ti.com

15-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

PT6941A

OBSOLETE SIP MODULE

ENF

27

TBD

Call TI

Call TI

PT6941C

LIFEBUY SIP MODULE

ENG

27

10

Pb-Free

(RoHS)

Call TI

Level-3-215C-168HRS

PT6942A

LIFEBUY SIP MODULE

ENF

27

10

Pb-Free

(RoHS)

Call TI

N / A for Pkg Type

PT6942C

LIFEBUY SIP MODULE

ENG

27

10

Pb-Free

(RoHS)

Call TI

Level-3-215C-168HRS

PT6943A

LIFEBUY SIP MODULE

ENF

27

10

Pb-Free

(RoHS)

Call TI

N / A for Pkg Type

PT6943C

LIFEBUY SIP MODULE

ENG

27

10

Pb-Free

(RoHS)

Call TI

Level-3-215C-168HRS

PT6944A

LIFEBUY SIP MODULE

ENF

27

10

Pb-Free

(RoHS)

Call TI

N / A for Pkg Type

PT6944C

LIFEBUY SIP MODULE

ENG

27

10

Pb-Free

(RoHS)

Call TI

Level-3-215C-168HRS

PT6944N

LIFEBUY SIP MODULE

ENE

27

10

Pb-Free

(RoHS)

Call TI

N / A for Pkg Type

PT6947A

LIFEBUY SIP MODULE

ENF

27

10

Pb-Free

(RoHS)

Call TI

N / A for Pkg Type

PT6947C

LIFEBUY SIP MODULE

ENG

27

10

Pb-Free

(RoHS)

Call TI

Level-3-215C-168HRS

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.